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A quantitative analysis for the stress field around an elastoplastic indentation/contact

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Abstract

In our previous paper [Feng et al., Acta Mater. 55, 2929 (2007)], an analytical model is proposed to estimate the stress field around an elastoplastic indentation/contact, matching nicely with the finite element analysis. The model is related to an embedded center of dilatation (ECD) in a half-space. In this paper, we focus on determining the ECD strength B* and the ECD depth ξ. By matching an expanding cavity model and the ECD model, we find that B* ≈ Yc3/6 and ξ ≈ 0.4c, where Y is the yield strength and c is the plastic zone radius. We provide a method to predict Y, c, and thereby B* as well as ξ through nanoindentation data, and we also demonstrate that pileup is the physical reason for the existence of the upper limit for the ratio of hardness to Y. Thus, our ECD model is completed by combining our previous paper (the analytical expression) and this paper (the essential parameters).

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Authors and Affiliations

  1. Division of Engineering, Brown University, Providence, Rhode Island, 02904, USA

    Gang Feng

  2. Department of Materials Science and Engineering, Stanford University, Stanford, California, 94305, USA

    Gang Feng

  3. Department of Engineering Mechanics, Zhejiang University, Hangzhou, 310027, China

    Shaoxing Qu

  4. International Center for New-Structured Materials, Zhejiang University, Hangzhou, 310027, China

    Shaoxing Qu

  5. Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston, Illinois, 61208, USA

    Yonggang Huang

  6. Department of Materials Science and Engineering, Stanford University, Stanford, California, 94305, USA

    William D. Nix

Authors
  1. Gang Feng
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  2. Shaoxing Qu
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  3. Yonggang Huang
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  4. William D. Nix
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Correspondence to Gang Feng.

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Feng, G., Qu, S., Huang, Y. et al. A quantitative analysis for the stress field around an elastoplastic indentation/contact. Journal of Materials Research 24, 704–718 (2009). https://doi.org/10.1557/jmr.2009.0097

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  • DOI: https://doi.org/10.1557/jmr.2009.0097

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