Skip to main content
SpringerLink
Log in

Microstructure evolution during electromigration between Sn–9Zn solder and Cu

  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

This study investigated the electromigration behavior between Cu and Sn–9Zn solder under a current density of 1.0 × 103 A/cm2 for up to 230 h. The experimental results indicated that Cu5Zn8 was formed at the interface between Cu and the cathode side of the Sn–9Zn solder as well as in the bulk near the anode. Consumption of Cu was also observed for the Cu plating on the cathode side and anodic side, but with less compound formation and Cu consumption at the anode. The intermetallic compound layer on the cathode side was always thicker than that on the anode side after the same current-stressing time. The effect of chemical potential overwhelms electromigration in inducing Zn diffusion when a counterflow of electrons and chemical potential gradient exists. Voids formed at the Cu5Zn8–solder interface inside the solder regardless of the direction of current flow.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. E.C.C Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan: Current-crowding-induced electromigration failure in flip chip solder joints. Appl. Phys. Lett. 80, 580 (2002).

    Article  CAS  Google Scholar 

  2. Y.C. Hu, Y.H. Lin, C.R. Kao, and K.N. Tu: Electromigration failure in flip chip solder joints due to rapid dissolution of copper. J. Mater. Res. 18, 2544 (2003).

    Article  CAS  Google Scholar 

  3. H. Ye, C. Basaran, and D. Hopkins: Thermomigration in Pn-Sn solder joints under joule heating during electric current stressing. Appl. Phys. Lett. 82, 1045 (2003).

    Article  CAS  Google Scholar 

  4. T.Y. Lee, K.N. Tu, and D.F. Frear: Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization. J. Appl. Phys. 90, 4502 (2001).

    Article  CAS  Google Scholar 

  5. Y.H. Lin, Y.C. Hu, C.M. Tsai, C.R. Kao, and K.N. Tu: In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing. Acta Mater. 53, 2029 (2005).

    Article  CAS  Google Scholar 

  6. W.J. Choi, E.C.C Yeh, and K.N. Tu: Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization. J. Appl. Phys. 94, 5665 (2003).

    Article  CAS  Google Scholar 

  7. J.W. Nah, K.W. Paik, J.O. Suh, and K.N. Tu: Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints. J. Appl. Phys. 94, 7560 (2003).

    Article  CAS  Google Scholar 

  8. Y.H. Lin, C.M. Tsai, Y.C. Hu, Y.L. Lin, and C.R. Kao: Electromigration-induced failure in flip-chip solder joints. J. Electron. Mater. 34, 1 (2005).

    Article  Google Scholar 

  9. T.L. Shao, Y.H. Chen, S.H. Chiu, and C. Chen: Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads. J. Appl. Phys. 96, 4518 (2004).

    Article  CAS  Google Scholar 

  10. J.W. Nah, J.O. Suh, and K.N. Tu: Effect of current crowding and joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature. J. Appl. Phys. 98, 013715 (2005).

    Article  Google Scholar 

  11. K.N. Tu: Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451 (2003).

    Article  CAS  Google Scholar 

  12. H. Gan and K.N. Tu: Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples. J. Appl. Phys. 97, 063514 (2005).

    Article  Google Scholar 

  13. C.M. Chen and S.W. Chen: Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures. Acta Mater. 50, 2461 (2002).

    Article  CAS  Google Scholar 

  14. C.M. Chen and S.W. Chen: Electromigration effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni interfacial reactions. J. Appl. Phys. 90, 1208 (2001).

    Article  CAS  Google Scholar 

  15. H.T. Orchard and A.L. Greer: Electromigration effects on compound growth at interfaces. Appl. Phys. Lett. 86, 231906 (2005).

    Article  Google Scholar 

  16. B. Salam, N.N. Ekere, and D. Rajkumar: Study of the interface microstructure of Sn–Ag–Cu lead-free solders and the effect of solder volume on intermetallic layer formation. In Proceedings of 51st Electronic Component & Technology Conference (IEEE, Piscataway, NJ, 2001), p. 471.

    Google Scholar 

  17. R.A. Islam, B.Y. Wu, M.O. Alam, Y.C. Chan, and W. Jillek: Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder. J Alloys Compd. 392, 149 (2005).

    Article  CAS  Google Scholar 

  18. M.N. Islam, Y.C. Chan, M.J. Rizvi, and W. Jillek: Investigations of interfacial reactions of Sn-Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn-Pb solder. J. Alloys Compd. 400, 136 (2005).

    Article  CAS  Google Scholar 

  19. B.J. Lee, N.M. Hwang, and H.M. Lee: Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation. Acta Mater. 45, 1867 (1997).

    Article  CAS  Google Scholar 

  20. J.W. Nah, F. Ren, K.N. Tu, S. Venk, and G. Gamara: Electromigration in Pb-free flip chip solder joints on flexible substrates. J. Appl. Phys. 99, 023520 (2006).

    Article  Google Scholar 

  21. P. Shewmon: Diffusion in Solids (Materials Research Society, Warrendale, PA, 1989).

    Google Scholar 

  22. C.Y. Liu, C. Chen, and K.N. Tu: Electromigration in Sn-Pb solder strips as a function of alloy composition. J. Appl. Phys. 88, 5703 (2000).

    Article  CAS  Google Scholar 

  23. Q.T. Huynh, C.Y. Liu, C. Chen, and K.N. Tu: Electromigration in eutectic SnPb solder lines. J. Appl. Phys. 89, 4332 (2001).

    Article  CAS  Google Scholar 

  24. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu: Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes. Appl. Phys. Lett. 75, 58 (1999).

    Article  CAS  Google Scholar 

  25. B.F. Dyson, T.R. Anthony, and D. Turnbull: Interstitial diffusion of copper in tin. J. Appl. Phys. 38, 3408 (1967).

    Article  CAS  Google Scholar 

  26. M. Date, K.N. Tu, T. Shoji, M. Fujiyoshi, and K. Sato: Interfacial reactions and impact reliability of Sn-Zn solder joints on Cu or electroless Au/Ni(P) bond-pads. J. Mater. Res. 19, 2887 (2004).

    Article  CAS  Google Scholar 

  27. F.H. Huang and H.B. Huntington: Diffusion of Sb124, Cd109, Sn113, and Zn65 in tin. Phys. Rev. B: Condens. Matter 9, 1479 (1974).

    Article  CAS  Google Scholar 

  28. T.C. Chang, M.C. Wang, and M.H. Hon: Crystal growth of the intermetallic compounds at the Sn–9Zn-xAg/Cu interface during isothermal aging. J. Cryst. Growth 252, 401 (2003).

    Article  CAS  Google Scholar 

  29. T.C. Chang, M.C. Wang, and M.H. Hon: Morphology and adhesion strength of the Sn–9Zn-3.5Ag/Cu interface after aging. J. Cryst. Growth 263, 223 (2004).

    Article  CAS  Google Scholar 

  30. S.P. Yu, H.J. Lin, M.H. Hon, and M.C. Wang: Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate. J. Mater. Sci.: Mater. Electron. 11, 461 (2000).

    CAS  Google Scholar 

  31. J.W. Yoon and S.B. Jung: Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder. J. Mater. Res. 21, 1590 (2006).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, 701, People’s Republic of China

    Shih-Ming Kuo & Kwang-Lung Lin

Authors
  1. Shih-Ming Kuo
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Kwang-Lung Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Shih-Ming Kuo.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Kuo, SM., Lin, KL. Microstructure evolution during electromigration between Sn–9Zn solder and Cu. Journal of Materials Research 22, 1240–1249 (2007). https://doi.org/10.1557/jmr.2007.0148

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/jmr.2007.0148

Search

Navigation