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Reactive Ion Etching (RIE) Induced p- to n-Type Conversion in Extrinsically Doped p-Type HgCdTe

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Abstract

Mercury annealing of reactive ion etching (RIE) induced p- to n-type conversion in extrinsically doped p-type epitaxial layers of HgCdTe (x=0.3 1) has been used to reconvert n-type conversion sustained during RIE processing. For the RIE processing conditions used (400mT, CH4/H2, 90 W) p- to n-type conversion was observed using laser beam induced current (LBIC) measurements. After a sealed tube mercury anneal at 200°C for 17 hours, LBIC measurements clearly indicated no n-type converted region remained. Subsequent Hall measurements confirmed that the material consisted of a p-type layer, with electrical properties equivalent to that of the initial as-grown wafer (NA-ND=2×1016 cm-3µ=350 cm2.V-1. S-1).

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Acknowledgement

This work was supported by the Australian Research Council (ARC), and the Cooperative Research Centre for Broadband Telecommunications and Networking (CRC-BTN).

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Correspondence to C. A. Musca.

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Musca, C.A., Smith, E.P.G., Siliquini, J.F. et al. Reactive Ion Etching (RIE) Induced p- to n-Type Conversion in Extrinsically Doped p-Type HgCdTe. MRS Online Proceedings Library 484, 353–358 (1997). https://doi.org/10.1557/PROC-484-353

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  • DOI: https://doi.org/10.1557/PROC-484-353

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