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New methods of analyzing indentation experiments on very thin films

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Abstract

Indentation experiments on thin films are analyzed by using a rigorous solution to model elastic substrate effects. Two cases are discussed: elastic indentations where film and substrate are anisotropic and elastoplastic indentations where significant material pileup occurs. We demonstrate that the elastic modulus of a thin film can be accurately measured in both cases, even if there is significant elastic mismatch between film and substrate.

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Authors and Affiliations

  1. CSM Instruments, Needham, Massachusetts, 02494, USA

    Han Li & Joost J. Vlassak

  2. School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts, 02138, USA

    Nicholas X. Randall

Authors
  1. Han Li
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  2. Nicholas X. Randall
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  3. Joost J. Vlassak
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Correspondence to Joost J. Vlassak.

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Li, H., Randall, N.X. & Vlassak, J.J. New methods of analyzing indentation experiments on very thin films. Journal of Materials Research 25, 728–734 (2010). https://doi.org/10.1557/JMR.2010.0095

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  • DOI: https://doi.org/10.1557/JMR.2010.0095

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