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Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

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Abstract

The kinetics of intermetallic compound (IMC) layer and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field was experimentally examined. It is found that the IMC layer growth is controlled by flux-driven ripening process. The high magnetic field promotes the growth of IMC layer, retards the dissolution of Cu substrate, and decreases the content of Cu solute at the liquid–IMC interface front. Based on the experimental results, it is considered that the magnetization induced by magnetic field promotes the ripening process for IMC layer growth. The Lorentz force dampening the convection and magnetization decreasing the Cu solubility limit can retard the Cu dissolution and change the solute distribution at the liquid–IMC interface front.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116085, China

    Cong-qian Cheng, Jie Zhao & Yang Xu

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  1. Cong-qian Cheng
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  2. Jie Zhao
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  3. Yang Xu
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Correspondence to Jie Zhao.

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Cheng, Cq., Zhao, J. & Xu, Y. Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field. Journal of Materials Research 25, 359–367 (2010). https://doi.org/10.1557/JMR.2010.0055

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  • DOI: https://doi.org/10.1557/JMR.2010.0055

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