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Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate

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Abstract

To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu–X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu–X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu–X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu–X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn–Bi solder widely used in the electronic interconnection in the future.

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Authors and Affiliations

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People’s Republic of China

    QingKe Zhang, HeFei Zou & Zhe-Feng Zhang

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  1. QingKe Zhang
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  2. HeFei Zou
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  3. Zhe-Feng Zhang
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Correspondence to Zhe-Feng Zhang.

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Zhang, Q., Zou, H. & Zhang, ZF. Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate. Journal of Materials Research 25, 303–314 (2010). https://doi.org/10.1557/JMR.2010.0035

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  • DOI: https://doi.org/10.1557/JMR.2010.0035

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