Abstract
Interfacial phase and microstructure, solder hardness, and joint strength of Sn–3.5Ag–X (X = Cu, In, Ni; compositions are all in wt% unless specified otherwise) solder alloys were investigated. Considering the melting behavior and the mechanical properties, five compositions of Sn–3.5Ag–X solder alloys were selected. To examine the joint characteristics, they were soldered on under bump metallurgy isothermally at 250 °C for 60 s. Aging and thermal cycling (T/C) were also performed on the solder joint. The interfacial microstructure of the joint was observed by scanning electron microscopy. X-ray diffraction and energy dispersive x-ray analyses were made toidentify the type of solder phase and to measure compositions. Excessive growth of an interfacial intermetallic layer in the Sn–3.5Ag–6.5 In solder joint led to a brittle fracture. In the other four solder joints, ductile fractures occurred through the solder region and the solder hardness was closely related with the joint strength.
Similar content being viewed by others
References
E. Bradley, Review of No-Lead Solder Issue, NEMI meeting (NEMI-National Electronics Manufacturing Initiative, Inc., Herndon, VA), Anaheim, CA, Feb. 23 (1999).
Lead-Free Solder Project NCMS Report 0401RE96 (National Center for Manufacturing Sciences, Ann Arbor, MI, Aug. 1997).
N.C. Lee, Chip Scale Review, March/April (2000), downloaded from www.pb-free.com.
IPC Road Map for Lead-Free Electronics Assemblies 2nd Draft, Nov (1999), downloaded from www.leadfree.org.
W.K. Choi and H.M. Lee, J. Electron. Mater. 28, 1251 (1999).
T.M. Korhonen and J.K. Kivilahti, J. Electron. Mater. 27, 149 (1998).
M. McCormack, G.W. Kammlott, H.S. Chen, and S. Jin, Appl. Phys. Lett. 65, 1233 (1994).
U.R. Kattner and W.J. Boettinger, J. Electron. Mater. 23, 603 (1994).
M. McCormack, S. Jin, G.W. Kammlott, and H.S. Chen, Appl. Phys. Lett. 63, 15 (1993).
K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).
I. Ohnuma, M. Miyashita, K. Anzai, X.J. Liu, H. Ohtani, and K. Ishida, J. Electron. Mater. 29, 1137 (2000).
Y. Kariya and M. Otsuka, J. Electron. Mater. 27, 1229 (1998).
S.W. Yoon, C.J. Park, S.H. Hong, J.T. Moon, I.S. Park, and H.S. Chun, J. Electron. Mater. 29, 1233 (2000).
B. Sundman, B. Jansson, and J.O. Andersson, CALPHAD 9, 153 (1985).
F.H. Hayes, H.L. Lukas, G. Effenberg, and G. Petzow, Z. Metallkd. 77, 749 (1986).
J-H. Shim, unpublished work, Seoul National University, Seoul, Korea (1997).
G. Ghosh, unpublished work, Northwestern University, Evanston, IL (1998).
C-S. Oh, J-H. Shim, B-J. Lee, and D.N. Lee, J. Alloys Compd. 238, 155 (1996).
J-H. Shim, C-S. Oh, B-J. Lee, and D.N. Lee, Z. Metallkd. 87, 205 (1996).
B-J. Lee, C-S. Oh, and J-H. Shim, J. Electron. Mater. 25, 983 (1996).
G. Ghosh, Metall. Mater. Trans. 30A, 1481 (1999).
W.K. Choi, S.W. Yoon, and H.M. Lee, Mater. Trans. JIM 42, 783 (2001).
J.Y. Park, J.S. Ha, C.S. Kang, K.S. Shin, M.H. Kim, and J.P. Jeong, J. Electron. Mater. 29, 1145 (2000).
T.M. Korhonen, P. Su, S.J. Hong, M.A. Korhonen, and C.Y. Li, J. Electron. Mater. 29, 1194 (2000).
D.R. Frear, IEEE Trans. Compon., Hybrids, Manuf. Technol. 13, 718 (1990).
W. Yang, R.W. Messler Jr., and L.E. Felton, J. Electron. Mater. 23, 765 (1994).
W.K. Choi and H.M. Lee, J. Electron. Mater. 29, 1207 (2000).
D.A. Porter and K.E. Easterling, Phase Transformations in Metals and Alloys, 2nd ed. (Chapman and Hall, London, United Kingdom, 1992).
D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, The Mechanics of Solder Alloy Interconnects (Van Nostrand Reinhold, NY, 1994).
C.J. Smithells, Metals Reference Book, 7th ed. (Butterworths, London, United Kingdom, 1976), Vol. 2.
J.H. Lau, Solder Joint Reliability (Van Nostrand Reinhold, NY, 1991).
D.R. Frear and P.T. Vianco, Metall. Mater. Trans. 25A, 1509 (1994).
R.J. Coyle, P.P. Solan, A.J. Serafino, and S.A. Gahr, in Proceedings of 50th Electronic Component and Technology Conference, Las Vegas, NV, May 21–24 (IEEE, Piscataway, NJ, 2000).
M.W. Barsoum and T. El -Raghy, J. Mater. Synth. Proc. 5, 197 (1997).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Choi, W.K., Kim, J.H., Jeong, S.W. et al. Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint. Journal of Materials Research 17, 43–51 (2002). https://doi.org/10.1557/JMR.2002.0009
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.2002.0009