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Rapid consolidation processing of silicon nitride powders

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Abstract

Using a Plasma Assisted Sintering (PAS) process, submicron size, silicon nitride powders were consolidated to >99% of the theoretical density (TD) at 1750 °C in less than 5 min with retention of the a phase and the submicron grain size. The silicon nitride powders were sintered with 5 wt.% Y2O3 and 5 wt.% Y2O3 + 5 wt. % MgAl2O4 additives. The PAS processing method for the silicon nitride additive mixtures is attractive for retention of fine-grained microstructures favorable for superplastic deformation. Post superplastic forming heat treatments to transform the α−Si3N4 to lath-like, creep-resistant β−Si3N4 is another feature of the present processing method.

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Authors and Affiliations

  1. Division of Materials Science and Engineering, Department of Chemical Engineering and Materials Science, University of California at Davis, Davis, California, 95616-5294, USA

    J. A. Schneider, S. H. Risbud & A. K. Mukherjee

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  1. J. A. Schneider
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  2. S. H. Risbud
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  3. A. K. Mukherjee
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Schneider, J.A., Risbud, S.H. & Mukherjee, A.K. Rapid consolidation processing of silicon nitride powders. Journal of Materials Research 11, 358–362 (1996). https://doi.org/10.1557/JMR.1996.0043

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  • DOI: https://doi.org/10.1557/JMR.1996.0043

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