Abstract
Oxide films are grown on a silicon wafer at low temperatures through the catalytic action of a thin gold film. Our results indicate that the oxide film thickness and morphology vary with the initial gold film thickness but do not significantly depend on the temperature. A Fourier analysis of the film structure suggests that the growth mechanism may include a spinodal decomposition where a binary alloy undergoes a phase separation. It is argued that gold silicide is the most likely candidate for spinodal decomposition.
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Leclerc, G., Paquin, L. & Baratay, F. Nonlinear silicon oxide growth patterns in a gold-silicon system. Journal of Materials Research 7, 2458–2464 (1992). https://doi.org/10.1557/JMR.1992.2458
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DOI: https://doi.org/10.1557/JMR.1992.2458