Skip to main content
SpringerLink
Log in

Soft vacuum, pulsed electron-beam hardening of lithographic polymers

  • Articles
  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

A 25 kV pulsed electron beam was used to harden 0.5−3.0μm thick AZ-type, MacDermid, and polyamic acid (PMDA + ODA) resist patterns. The resist profiles are stable against high-temperature treatment that ranges between 200−350 °C. The short pulse ∼ 100 ns, electron beams employed in resist hardening are produced from a cold cathode in 30−50 m Torr air by discharging energy stored in a 7.5 nF capacitor producing a dose/pulse ∼ 1μC/cm2 at the processed surface. Comparisons with conventional hardening methods using ultraviolet emission from a high-pressure mercury lamp, a windowless, vacuum ultraviolet (VUV) lamp, and low-energy electron emission from a cw source are also made.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. P. Burggraaf, Semicond. Int., P84 (April 1987).

  2. A. Weill and E. Dechenaux, J. Vac. Sci. Technol. B 5(3), 667 (1987).

    Article  Google Scholar 

  3. J. J. Grunwald, SPIE Vol. 631, Advances in Resist Technology and Processing III, (1986); see also Semicond. Int., P4 (April 1988)

  4. H. Hiraoka and J. Pacansky, J. Electrochem. Soc. 128, 2645 (1981).

    Article  CAS  Google Scholar 

  5. W. H. L. Ma, United States Patent No. 4, 187,331.

  6. K. Hashimoto, K. Yamashita, K. Kawakita, and N. Nomura, The Electrochemical Society Meeting, Paper 734 of the Joint General Session, Honolulu, HI, October 1987.

  7. An electron beam curing/stabilizing system is commercially available from Electron Vision Corporation, 9747 Business Park Avenue, San Diego, CA 92131.

  8. W. Moreau, Microcircuit Eng. 83, 320 (1983).

    Google Scholar 

  9. H. Haraoka and J. Pacansky, J. Vac. Sci. Technol. 19(4), 1132 (1981).

    Article  Google Scholar 

  10. K. J. Orvek and M. L. Dennis, SPIE Conference on Microlitho-graphy, Paper No. 771 47, Santa Clara, CA, 1987.

  11. H. Hiraoka, J. Lee, W. Hinsberg, J. Krishnaswamy, L. Li, and G. J. Collins, The Electrochemical Society Meeting, Symposium on Patterning Science and Technology, Paper No. 476, Honolulu, HI, 18–23 October 1987. See also J. Krishnaswamy, L. Li, G. J. Collins, H. Hiraoka, and M. A. Caolo, Fall Meeting of the Materials Research Society, Sym. B., Paper No. B7.9, Boston, MA 1–6 December 1987; United States patents application for apparatus and process are pending.

  12. W. H.- L. Ma, SPIE Submicron Lithography, 333, 19, 1982.

    Article  CAS  Google Scholar 

  13. C. Johnson, Jr., S. M. Ku, H. V. Lillja, and E. J. Pan, United States Patent No. 3,920,483.

  14. J. M. Moran and G. N. Taylor, J. Vac. Sci. Technol. 19(4), 1127 (1981).

    Article  CAS  Google Scholar 

  15. R. Srinivasan, IBM Journal of Research and Developoment, RC 9177 (1981) ; see also R. Srinivasan and B. Braren, J. Polym. Sci. 22, 2601 (1984).

  16. H. Ryssel, K. Haberger, and H. Krantz, J. Vac. Sci. Technol. 19(4), 1358 (1981).

    Article  CAS  Google Scholar 

  17. A. Novembre and T. N. Bowmer, in Materials for Microlithography, edited by C. G. Wilson, L. F. Thomson, and J. M. J. Fre’chet, ACS Symposium Series No. 266 (ACS, Washington, DC, 1984), Chap. 11, p. 241.

    Google Scholar 

  18. J. Krishnaswamy, L. Li, G. J. Collins, H. Hiraoka, and M. A. Caolo, Mater. Res. Soc. Proc. 76, 91 (1987); see also IBM Internal Report, RJ 5441 (55690) (1986).

    Article  Google Scholar 

  19. S. W. Downey, L. A. Bilta, R. L. Carlon, S. J. Czuchlewski, and D. C. Moir, J. Appl. Phys. 60(10), 34 (1986).

    Article  Google Scholar 

  20. J. Krishnaswamy, L. Li, G. J. Collins, H. Hiraoka, and M. A. Caolo, Proceedings of SPIE, Electron-Beam, X-Ray, and Ion-Beam Lithographies VI, 5–6 March 1987, Santa Clara, CA, Vol. 773, p. 159.

  21. L. Li, J. Krishnaswamy, G. J. Collins, and M. A. Caolo, J. Electrochem. Soc. (submitted for publication).

  22. T. Sheng, Z. Yu, and G. J. Collins, Appl. Phys. Lett 52(7), 576 (1988).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Electrical Engineering, Colorado State University, Fort Collins, 80523, Colorado, USA

    J. Krishnaswamy, L. Li & G. J. Collins

  2. IBM Almaden Research Center, San Jose, 95120-6099, California, USA

    H. Hiraoka

  3. Hewlett-Packard Company, Fort Collins, 80525, Colorado, USA

    M. A. Caolo

Authors
  1. J. Krishnaswamy
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. L. Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. G. J. Collins
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. H. Hiraoka
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. M. A. Caolo
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Krishnaswamy, J., Li, L., Collins, G.J. et al. Soft vacuum, pulsed electron-beam hardening of lithographic polymers. Journal of Materials Research 3, 1259–1267 (1988). https://doi.org/10.1557/JMR.1988.1259

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/JMR.1988.1259

Search

Navigation