Abstract
The description of heat-resistant cold and hot-setting adhesives developed by the All-Russian Scientific Research Institute of Aviation Materials (VIAM) is presented. The organic-silicon rubber or epoxy-organic-silicon resin are used as a binder for the cold-setting adhesives, and the phenol-organic-silicon resin and a mixture of inorganic compounds are used as a binder for the hot-setting adhesives. The range of operational temperatures for adhesive joints is determined. It is shown that the presented adhesives can be used to fix different sensors.
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Original Russian Text © N.F. Lukina, A.P. Petrova, E.V. Kotova, 2010, published in Klei. Germetiki. Tekhnologii, 2010, No. 5, pp. 7–9.
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Lukina, N.F., Petrova, A.P. & Kotova, E.V. Heat-resistant adhesives for thermo- and tensometrics. Polym. Sci. Ser. D 3, 249–251 (2010). https://doi.org/10.1134/S1995421210040088
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DOI: https://doi.org/10.1134/S1995421210040088