Abstract
A method for calculating residual stresses in the adhesive layer is reported and results obtained are compared with experimental data. Theoretical calculations are performed under the assumptions that epoxy adhesive is an elastic material that obeys Hooke’s law. Residual stresses are measured by the console method.
Similar content being viewed by others
References
J.-J. Villenave, Assemblage par collage (Dunod, Paris, 2005; Tekhnosfera, Moscow, 2007).
A. V. Talalai, A. F. Voloshkin, and Yu. S. Kochergin, Klei Germet. Tekhnol., No. 8, 23 (2006).
V. I. Bashkirtsev, V. I. Balabonov, and S. N. Gladkikh, Mekhaniz. Elektrif. Sel’sk. Khoz., No. 6, 31 (2003).
L. A. Sukhareva and V. S. Yakovlev, Polymeric and Inorganic Protective Coatings (Pishchevaya Promyshlennost’, Moscow, 2001) [in Russian].
Author information
Authors and Affiliations
Corresponding author
Additional information
Original Russian Text © N.I. Baurova, 2008, published in Klei. Germetiki. Tekhnologii, 2008, No. 6, pp. 29–31.
Rights and permissions
About this article
Cite this article
Baurova, N.I. Determination of residual stresses in adhesive materials based on epoxy oligomers. Polym. Sci. Ser. D 1, 269–271 (2008). https://doi.org/10.1134/S1995421208040126
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1995421208040126