Abstract
The impinging jet technique is a high-performance cooling technology for microchips which are basic elements of electronic systems and having high heat generation rates in small volumes. In this study, the improvement of heat transfer of the microchips used in all technological products today by air impinging jet has been examined. For this purpose, numerical research has been carried out on the cooling of copper plate surfaces with two different patterns, reverse triangle and reverse semi-circle shaped having 1000 W/m2 constant heat flux in rectangular cross-section ducts with adiabatic surfaces, by one and double air jets with distances of D\(_{h}\) and 2D\(_{h}\) between them. Numerical computation has been performed for energy and Navier–Stokes equations as steady and three-dimensional by employing the Ansys-Fluent computer program with the k-\(\varepsilon\) turbulence model. The obtained results have been compared with the numerical and experimental results of the study in the literature and it has been seen that they are compatible with each other. The results have been presented as the mean Nu number and the variation of surface temperature for each of both patterned surfaces in single and double jet channels with different distances. Streamline and temperature contour distributions of the jet flow along the channel for different H/D\(_{h}\) ratios and jet numbers have been evaluated for both patterned surfaces. In double-jet and 2D\(_{h}\) distance channels compared to D\(_{h}\), at H/D\(_{h}\) = 12 and Re = 11,000, the Nu number increases of 67% and 65.9% have been observed on the first-row reverse triangle and semi-circular patterned surfaces, respectively.
REFERENCES
Narumanchi, S.V.J., Amon, C.H., and Murthy, J.Y., Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena, Trans. ASME, 2003, vol. 125, pp. 354–361; https://doi.org/ 10.1115/1.1572903
Kercher, D.S., Lee, J.B., Brand, O., Allen, M.G., and Glezer, A., Microjet Cooling Devices for Thermal Management of Electronics, IEEE Trans. Comp. Pack. Techn., 2003, vol. 26, pp. 359–366; https://doi.org/10.1109/TCAPT.2003.815116
Carlomagno, G.M. and Ianiro, A., Thermo-Fluid-Dynamics of Submerged Jets Impinging at Short Nozzle-to-Plate Distance: A Review, Exp. Therm. Fluid Sci., 2014, vol. 58, pp. 15–35; https://doi.org/ 10.1016/j.expthermflusci.2014.06.010
Arguis, E., Rady, M.A., and Nada, S.A., A Numerical Investigation and Parametric Study of Cooling an Array of Multiple Protruding Heat Sources by a Laminar Slot Air Jet, Int. J. Heat Mass Transfer, 2007, vol. 28, pp. 787–805; https://doi.org/10.1016/j.ijheatfluidflow.2006.09.004
Popovac. M, and Hanjalic, K., Large-Eddy Simulation of Flow over a Jet-Impinged Wall Mounted Cube in a Cross Stream, Int. J. Heat Fluid Flow, 2007, vol. 28, pp. 1360–1378; https://doi.org/ 10.1016/j.ijheatfluidflow.2007.05.009
Barbosa, F.V., Teixeira, S.F.C.F., and Teixeira, J.C.F., Convection from Multiple Air Jet Impingement—A Review, Appl. Therm. Eng., 2023, vol. 218, p. 119307; https://doi.org/10.1016/ j.applthermaleng.2022.119307
Karabulut, K. and Alnak, D.E., Study of Cooling of the Varied Designed Warmed Surfaces with an Air Jet Impingement, Pamukkale Univ. J. Eng. Sci., 2020, vol. 26, pp. 88–98; https://doi.org/ 10.5505/pajes.2019.58812
Karabulut, K., Heat Transfer Improvement Study of Electronic Component Surfaces Using Air Jet Impingement, J. Comp. Elect., 2019, vol. 18, pp. 1259–1271; https://doi.org/10.1007/s10825-019- 01387-3
Tepe, A.Ü., Numerical Investigation of a Novel Jet Hole Design for Staggered Array Jet Impingement Cooling on a Semicircular Concave Surface, Int. J. Therm. Sci., 2021, vol. 162, p. 106792; https://doi.org/10.1016/j.ijthermalsci.2020.106792
Yogi, K., Krishnan, S., and Prabhu, S.V., Experimental Investigation on the Local Heat Transfer with an Unconfined Slot Jet Impinging on a Metal Foamed Flat Plate, Int. J. Therm. Sci., 2021, vol. 169, p. 107065; https://doi.org/10.1016/j.ijthermalsci.2021.107065
Wu, J.Y., Lv, R.R., Huang, Y.Y., and Yang, G., Transverse Buoyant Jet-Induced Mixed Convection Inside a Large Thermal Cycling Test Chamber with Perforated Plates, Int. J. Therm. Sci., 2021, vol. 168, p. 107080; https://doi.org/10.1016/j.ijthermalsci.2021.107080
Rathore, S.S. and Verma, S.K., Numerical Investigation on the Efficacy of Jet Obliquity for Fluid Flow and Thermal Characteristics of Turbulent Offset Jet, Heat Mass Transfer, 2022, vol. 58, pp. 1223–1246; https://doi.org/10.1007/s00231-021-03156-0
Zou, L., Ning, L., Wang, X., Li, Z., He, L., and Ll, H., Evaluation of Interfacial Heat Transfer Coefficient Based on the Experiment and Numerical Simulation in the Air-Cooling Process, Heat Mass Transfer, 2022, vol. 58, pp. 337–354; https://doi.org/10.1007/s00231-021-03113-x
Koca, F. and Zabun, M., The Effect of Outlet Location on Heat Transfer Performance in Micro Pin-Fin Cooling Used for a CPU, European Phys. J. Plus, 2021, vol. 136, no. 11, p. 1115; https://doi.org/10.1140/epjp/s13360-021-02113-4
Koca, F. and Güder, T.B., Numerical Investigation of CPU Cooling with Micro-Pin-Fin Heat Sink in Different Shapes, European Phys. J. Plus, 2022, vol. 137, no. 11, p. 2276; https://doi.org/10.1140/ epjp/s13360-021-02113-4
Diop, S.N., Dieng, B., and Senaha, I., A Study on Heat Transfer Characteristics by Impinging Jet with Several Velocities Distribution, Case Stud. Therm. Eng., 2021, vol. 26, p. 101111; https://doi.org/10.1016/j.csite.2021.101111
Leena, R., Syamkumar, G., and Prakash, M.J., Experimental and Numerical Analyses of Multiple Jets Impingement Cooling for High-Power Electronics, IEEE Trans. Comp. Pack. Manuf. Tech., 2018, vol. 8, pp. 210–215; https://doi.org/10.1109/TCPMT.2017.2783629
Belarbi, A.A., Beriache, M., and Bettahar, A., Experimental Study of Aero-Thermal Heat Sink Performances Subjected to Impinging Air Flow, Int. J. Heat Tech., 2018, vol. 36, pp. 1310–1317; https://doi.org/10.18280/ijht.360420
Jones-Jackson, S., Rodriguez, R., and Emadi, A., Jet Impingement Cooling in Power Electronics for Electrified Automotive Transportation: Current Status and Future Trends, IEEE Trans. Power Elect., 2021, vol. 36, pp. 10420–10435; https://doi.org/10.1109/TPEL.2021.3059558
Carneiro, M.V.P. and Barbosa, Jr., J., A Comparison of Parallel and Colliding Jet Arrays in a Compact Vapour Compression Heat Sink for Electronics Cooling, Appl. Therm. Eng. 2021, vol. 195, p. 117217; https://doi.org/10.1016/j.applthermaleng.2021.117217
Radmard, V., Hadad, Y., Rangarajan, S., Hoang, C.H., Fallahtafti, N., Arvin, C.L., Sikka, K., Schiffres, S.N., and Sammakia, B.G., Multi-Objective Optimization of a Chip-Attached Micro Pin Fin Liquid Cooling System, Appl. Therm. Eng., 2021, vol. 195, p. 117187; https://doi.org/10.1016/ j.applthermaleng.2021.117187
Wang, S.J. and Mujumdar, A.S., A Comparative Study of Five Low Reynolds Number k-ε Models for Impingement Heat Transfer, Appl. Therm. Eng., 2005, vol. 25, pp. 31–44; https://doi.org/10.1016/ j.applthermaleng.2004.06.001
Kilic, M., Calisir, T., and Baskaya, S., Experimental and Numerical Study of Heat Transfer from a Heated Flat Plate in a Rectangular Channel with an Impinging Air Jet, J. Braz. Soc. Mech. Sci. Eng., 2017, vol. 39, pp. 329–344; https://doi.org/10.1007/s40430-016-0521-y
Author information
Authors and Affiliations
Corresponding authors
Additional information
Publisher’s Note. Pleiades Publishing remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Alnak, D.E., Karabulut, K. Investigation of Heat Transfer Increment in Electronic System Surfaces by Different Air Jet Impingement Applications. J. Engin. Thermophys. 33, 161–185 (2024). https://doi.org/10.1134/S1810232824010120
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1810232824010120