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Highly Heat-Resistant Poly(Amido Hydroxy Amides) with Increased Elongation at Break and Photosensitive Formulations Based on Them

  • Macromolecular Compounds and Polymeric Materials
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Abstract

A series of poly(o-hydroxy amides) were prepared by polycondensation of 3,3ʹ-methylenebis(6-aminophenol) with isophthaloyl chloride or 2-(4-carboxyphenyl)-1,3-dioxoisoindoline-5-carboxylic acid dichloride, and also by copolycondensation of mixtures of this diamine and 4,4ʹ-diaminodiphenyl ether or 1,3-bis(4-aminophenoxy)benzene with isophthaloyl chloride. The properties of the products obtained were studied. Thermal cyclization of poly(o-hydroxy amides) yielded the corresponding poly(benzoxazoles). A film of the poly(o-hydroxy amide) derived from 3,3ʹ-methylenebis(6-aminophenol) and 2-(4-carboxyphenyl)-1,3-dioxoisoindoline-5-carboxylic acid dichloride with 50% elongation at break remains plastic (the enlongation at break exceeds 6%) even after the heat treatment and closure of benzoxazole rings; the elastic modulus of such film is 1.2 times higher than that of the poly(o-hydroxy amide) film containing 1,3-bis(4-aminophenoxy)benzene and isophthaloyl chloride moieties. Formulations allowing formation of an adhesion-strong highly heat-resistant relief with the micrometer size of elements and high dielectric parameters on semiconductor substrates were prepared by adding a photosensitive component of naphthoquinone diazide type to poly(o-hydroxy amide) reactive solutions in 1 : 5 ratio relative to the dry polymer.

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Funding

The study was supported by the Ministry of Science and Higher Education of the Russian Federation (government assignment 0785.00.Х6019).

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Authors and Affiliations

  1. Institute of Macromolecular Compounds, Russian Academy of Sciences, 199004, St. Petersburg, Russia

    M. N. Bol’shakov, G. K. Lebedeva & I. V. Gofman

  2. St. Petersburg State Institute of Technology (Technical University), 190013, St. Petersburg, Russia

    A. Yu. Marfichev, L. I. Rudaya & S. M. Ramsh

  3. Ulyanov (Lenin) St. Petersburg State Electrotechnical University Leningrad Electrotechnical Institute, 197376, St. Petersburg, Russia

    I. M. Sokolova & D. A. Chigirev

Authors
  1. M. N. Bol’shakov
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  2. G. K. Lebedeva
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  3. A. Yu. Marfichev
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  4. I. V. Gofman
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  5. L. I. Rudaya
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  6. I. M. Sokolova
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  7. D. A. Chigirev
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  8. S. M. Ramsh
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Contributions

M.N. Bol’shakov, G.K. Lebedeva, A.Yu. Marfichev, and L.I. Rudaya: synthesis of polymers and preparation of samples for the studies and formulation and study of photosensitive composites; I.V. Gofman: evaulation of the heat resistance and mechanical characteristics of the polymers in powders and films; I.M. Sokolova and D.A. Chigirev: sample preparation and study of the electrophysical properties of the films; S.M. Ramsh: analysis and theoretical substantiation of the experimental data obtained.

Corresponding author

Correspondence to M. N. Bol’shakov.

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The authors declare that they have no conflict of interest.

Additional information

Translated from Zhurnal Prikladnoi Khimii, No. 4, pp. 490–500, March, 2022 https://doi.org/10.31857/S0044461822040107

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Bol’shakov, M.N., Lebedeva, G.K., Marfichev, A.Y. et al. Highly Heat-Resistant Poly(Amido Hydroxy Amides) with Increased Elongation at Break and Photosensitive Formulations Based on Them. Russ J Appl Chem 95, 551–560 (2022). https://doi.org/10.1134/S1070427222040115

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  • DOI: https://doi.org/10.1134/S1070427222040115

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