Abstract
The phosphorus-containing organosilicon varnish was synthesized by heating 3-aminopropyltriethoxysilane, triphenyl phosphate, and octamethylcyclotetrasiloxane. Heat-resistant coatings formed on its basis were investigated by thermogravimetry, electronic absorption spectroscopy, IR spectroscopy, gas chromatography-mass spectrometry, and atomic force microscopy.
Similar content being viewed by others
References
Sorokin, M.F., Kochnova, Z.A., and Shode, L.G., Khimiya i tekhnologiya plenkoobrazuyushchikh veshchestv (Chemistry and Technology of Film-Forming Substances), Moscow: Khimiya, 1989.
Kharitonov, N.P. and Ostrovskii, V.V., Termicheskaya i termookislitel’naya destruktsiya poliorganosiloksanov (Thermal and Thermaoxidation Decomposition of Polyorganisiloxanes), Leningrad: Nauka, 1982.
Rokhov, E.D., Mir kremniya (Silicon), Moscow: Khimiya, 1990.
Sobolevskii, M.V., Muzovskaya, O.A., and Popeleva, G.S., Svoistva i oblasti primeneniya kremniiorganicheskikh produktov (Properties and Fields of Application of Organosilicon Products), Moscow: Khimiya, 1975.
Molotova, V.A., Promyshlennoe primenenie kremniiorganicheskikh lakokrasochnykh pokrytii (Industrial Application of Organosilicon Varnish Coatings), Moscow: Khimiya, 1978.
RF Patent 2418024.
Miller, T.N. and Vitola, A.A., Neorganicheskie soedineniya fosfora s azotom (Inorganic Compounds of Phosphorus with Nitrogen), Riga: Zinatne, 1986.
Shagidullin, R.R., Chernova, A.V., Vinogradova, V.S., and Mukhametov, F.S., Atlas IK spektrov fosfororganicheskikh soedinenii (Atlas of IR spectra of Organophosphorus Compounds), Moscow: Nauka, 1984.
Author information
Authors and Affiliations
Corresponding author
Additional information
Original English Text © V.V. Semenov, 2013, published in Zhurnal Prikladnoi Khimii, 2013, Vol. 86, No. 11, pp. 1831–1836.
Rights and permissions
About this article
Cite this article
Semenov, V.V. Fast cured heat resistant coatings based on phosphorus-containing organosilicon varnish. Russ J Appl Chem 86, 1779–1784 (2013). https://doi.org/10.1134/S1070427213110244
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1070427213110244