Abstract
The electrodynamic microstructure technologies for production of millimeter and submillimeter-wave vacuum microelectronic devices are reviewed, including photolithography, deep reactive ion etching, computer numerical control micro- and nanomilling, electro-erosive micromachining, and additive technologies: 3D printing, selective laser sintering, and selective laser melting. An original approach to manufacture of planar slow-wave systems based on magnetron sputtering and laser ablation is discussed. Technological tolerances and surface roughness that can be obtained using the considered technologies are compared.
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Notes
The LIGA acronym owes its origin to the German names of the main process stages: lithography (Lithographie), electroforming (Galvanoformung), and molding (Abformung).
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Funding
This work was supported by the Russian Science Foundation (Production and Study of 3D Printed Structures), project no. 22-12-00181 and the Russian Foundation for Basic Research (Laser Ablation Production and Study of Structures), project no. 20-07-00929.
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Translated by E. Bondareva
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Starodubov, A.V., Nozhkin, D.A., Rasulov, I.I. et al. Technologies for Forming Electrodynamic Structures for Millimeter-Wave and Terahertz Vacuum Microelectronic Devices (Review). J. Commun. Technol. Electron. 67, 1189–1197 (2022). https://doi.org/10.1134/S1064226922100126
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DOI: https://doi.org/10.1134/S1064226922100126