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Thinning of the Backside of the InSb(100) Matrix Module and Its Effect on the Crystal Structure of Near Surface Layers

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Abstract

Two methods of back thinning of an InSb(100) matrix module using abrasive and non-abrasive polishing are compared by various analytical methods. It is shown that an extra stage of mechanical grinding allows one to achieve a significant improvement in the geometry of the matrix module after finishing polishing in comparison with a non-abrasive technique. The arithmetic mean of the surface roughness after all stages of processing does not exceed the permissible values. The degree of influence of various processing methods on the crystal structure of the material is estimated by reciprocal space maps.

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Authors and Affiliations

  1. JSC Scientific and Production Association Orion, 111538, Moscow, Russia

    E. V. Mirofyanchenko, A. E. Mirofyanchenko & V. S. Popov

  2. Moscow Institute of Physics and Technology (National Research University), 141701, Dolgoprudny, Moscow oblast, Russia

    E. V. Mirofyanchenko, A. E. Mirofyanchenko & V. S. Popov

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  1. E. V. Mirofyanchenko
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  2. A. E. Mirofyanchenko
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  3. V. S. Popov
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Correspondence to E. V. Mirofyanchenko.

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Mirofyanchenko, E.V., Mirofyanchenko, A.E. & Popov, V.S. Thinning of the Backside of the InSb(100) Matrix Module and Its Effect on the Crystal Structure of Near Surface Layers. J. Commun. Technol. Electron. 67, 313–318 (2022). https://doi.org/10.1134/S1064226922030111

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  • DOI: https://doi.org/10.1134/S1064226922030111

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