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Mechanical Stresses and Magnetic Properties of NiFe and CoNiFe Films Obtained by Electrochemical Deposition

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Abstract

Magnetic films of NiFe permalloy and CoNiFe ternary alloy are used in products of nanoelectronics and microelectronics and in densely packed magnetic memory. NiFe and CoNiFe coatings decrease corrosion and wear in electrical devices; they are also used in electrocatalytic materials. Large stresses in magnetic films lead to deformations and the malfunctioning of devices due to peeling of the film from the silicon substrate. In this study, to clarify the nature of the phenomena occurring during the electrochemical deposition of NiFe and CoNiFe films of various thicknesses, which lead to mechanical stresses, investigation of their parameters is carried out. It is demonstrated that measurement of the bending of wafers consisting of Si, SiO2, Si3N4, NiCr, and Ni after the deposition of CoNiFe or NiFe layers on each of them allows determination of the mechanical stresses in the films. It is established that the beinding of the wafers with Si3N4 is negative and greater than that with SiO2. The bending after depositing NiCr and Ni layers is negative. The bending of silicon wafers with CoNiFe ternary-alloy films has a maximum value of 180 μm at a film thickness of 12 μm, and that with NiFe films has a maximum value of 150 μm at a film thickness of 15 μm. The bending after depositing NiFe and CoNiFe films is positive. No peeling of the films is observed. The difference in the deformation signs of Ni and CoNiFe or NiFe films and in the direct dependence of the silicon-wafer bending on the thickness of NiFe and CoNiFe films makes it possible to relate the mechanical stresses to hydrogenation (hydrogen embrittlement) and hydrogen release after the process. It is determined that the magnetization of NiFe films is lower than that of triple CoNiFe films. The latter are promising for use in magnetic-field converters.

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REFERENCES

  1. I. Tobakovic, V. Inturi, and S. Riemer, J. Electrochem. Soc. 149, C18 (2002). https://doi.org/10.1149/1.1421346

    Article  Google Scholar 

  2. D.-Y. Park, B. Y. Yoo, S. Kelcher, and N. V. Myung, Electrochim. Acta 51, 2523 (2006). https://doi.org/10.1016/j.electacta.2005.07.037

    Article  Google Scholar 

  3. J.-S. Kim, J.-H. Kwak, S.-H. Na, et al., J. Korean Phys. Soc. 61, 609 (2012). https://doi.org/10.3938/jkps.61.609

    Article  ADS  Google Scholar 

  4. B.-K. Koo, J. Korean Inst. Surf. Eng. 44 (4), 137 (2011). https://doi.org/10.5695/JKISE.2011.44.4.137

    Article  Google Scholar 

  5. Y. Wu, B. Ji, and W. Wang, Processes 9, 1883 (2021). https://doi.org/10.3390/pr9111883

    Article  Google Scholar 

  6. V. N. Dzhuplin, V. S. Klimin, Yu. V. Morozova, A. A. Rezvan, Z. E. Vakulov, and O. A. Ageev, Russ. Microelectron. 50, 412 (2021). https://doi.org/10.1134/S1063739721060056

    Article  Google Scholar 

  7. R. D. Tikhonov, A. A. Cheremisinov, D. V. Gorelov, and Yu. V. Kazakov, Nano- Mikrosist. Tekh. 22 (3), 123 (2020). https://doi.org/10.17587/nmst.22.123-135

    Article  Google Scholar 

  8. R. D. Tikhonov, S. A. Polomoshnov, V. V. Amelichev, et al., Izv. Vyssh. Uchebn. Zaved., Elektron. 26, 246 (2021). https://doi.org/10.24151/1561-5405-2021-26-3-4-246-254

    Article  Google Scholar 

  9. R. D. Tikhonov, A. A. Cheremisinov, and M. R. Tikhonov, Russ. J. Electrochem. 57, 1151 (2021). https://doi.org/10.1134/S1023193521120077

    Article  Google Scholar 

  10. E. Chason, Measurement of Stress Evolution in Thin Films Using Real-Time in situ Wafer Curvature (k-Space MOS), k-Space. https://www.k-space.com/wp-content/uploads/MOSforThinFilms.pdf. Accessed May 16, 2022.

  11. V. I. Anur’ev, Handbook of the Designer-Machine Builder, Ed. by I. N. Zhestkova, 8th ed. (Mashinostroenie, Moscow, 2001), Vol. 1 [in Russian].

    Google Scholar 

  12. P. M. Vyacheslavov, Electrolytic Deposition of Alloys, 4th ed. (Mashinostroenie, Leningrad, 1977) [in Russian].

    Google Scholar 

  13. S. M. Beloglazov, Electrochemical Hydrogen and Metals: Behavior, Combating Embrittlement (Kaliningr. Gos. Univ., Kaliningrad, 2004) [in Russian].

    Google Scholar 

  14. B. B. Damaskin, O. A. Petrii, and G. A. Tsirlina, Electrochemistry, The School-Book, 3rd ed (Lan’, St. Petersburg, 2015) [in Russian].

  15. Y. Yang, Int. J. Electrochem. Sci. 10, 5164 (2015).

    Google Scholar 

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ACKNOWLEDGMENTS

The work was performed with equipment of the Center for Collective Use “Functional Control and Diagnostics of Microsystem and Nanosystem Equipment” based on the NPK “Technological Center” (Moscow).

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Authors and Affiliations

  1. SMC “Technological Centre”, 124498, Moscow, Russia

    R. D. Tikhonov, S. A. Polomoshnov, V. V. Amelichev, A. A. Cheremisinov, V. S. Potapov, D. V. Gorelov & Ju. V. Kasakov

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  1. R. D. Tikhonov
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  2. S. A. Polomoshnov
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  3. V. V. Amelichev
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  4. A. A. Cheremisinov
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  5. V. S. Potapov
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  6. D. V. Gorelov
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  7. Ju. V. Kasakov
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Correspondence to R. D. Tikhonov.

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Translated by V. Bukhanov

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Tikhonov, R.D., Polomoshnov, S.A., Amelichev, V.V. et al. Mechanical Stresses and Magnetic Properties of NiFe and CoNiFe Films Obtained by Electrochemical Deposition. Semiconductors 56, 431–436 (2022). https://doi.org/10.1134/S1063782622130115

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  • DOI: https://doi.org/10.1134/S1063782622130115

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