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AFM investigation of thin post-baked photoresistive films for microsystem technology application

  • The 8th International Workshop on Beam Injection Assessment of Microstructures in Semiconductors, June 11–14, 2006, St. Petersburg, Russia
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Abstract

In this paper, we discuss the application of photoresist films as the sacrificial layers for “bridge” working elements in microsystem technology. Different regimes and conditions of post-baking and plasma chemical etching processes for the formation of sacrificial layers with precise thickness and roughness are investigated. The photoresist surface morphology was observed with the help of atomic force and scanning electron microscopy.

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References

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Authors and Affiliations

  1. St. Petersburg State Polytechnical University, St. Petersburg, 195251, Russia

    S. E. Alexandrov, A. B. Speshilova, Y. V. Soloviev & O. I. Ermeychik

Authors
  1. S. E. Alexandrov
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  2. A. B. Speshilova
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  3. Y. V. Soloviev
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  4. O. I. Ermeychik
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The text was submitted by the authors in English.

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Alexandrov, S.E., Speshilova, A.B., Soloviev, Y.V. et al. AFM investigation of thin post-baked photoresistive films for microsystem technology application. Semiconductors 41, 469–472 (2007). https://doi.org/10.1134/S1063782607040215

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  • DOI: https://doi.org/10.1134/S1063782607040215

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