Abstract
The ICP plasma chemical reactor is studied by using the probe plasma diagnostic methods. The plasma density in the wafer region was evaluated at different parameters of the process. The automatic bias potential on the surface of glass wafers of different thickness and uniformity of the ion current density distribution over the plate diameter are measured. The deep silicon etching mode with a high uniformity over the whole plate is determined.
Similar content being viewed by others
References
Rudenko, K.V., Sukhanov, Ya.N., and Orlikovskii, A.A., Diagnostics in situ and Control of Plasma Processes in Microelectronic Technology, in Entsiklopediya nizkotemperaturnoi plazmy, Lebedev, Yu.A., Plate, N.A., and Fortov, V.E., Eds., Moscow: Yanus-K, 2006, vol. XII-5, pp. 381–436.
Dudin, S.V., Yatskov, A.P., and Farenik, V.I., Equipment for Probe Diagnostics and Control of Plasma Manufacturing Processes, Tekhnologiya i konstruirovanie v elektronnoi apparature, 2002, no. 3, pp. 43–50.
Chen, F.F., Langmuir Probe Analysis for High-Density Plasmas, Los Angeles: Univ. of California, LTP-006, 2000, p. 34.
Myakon’kikh A.V. Monitoring of Plasma Chemical Processes of Microand Nanostructure Formations by the Probe Diagnostic Methods, Cand. Sci. (Phys.-Math.) Dissertation, Moscow, 2009, p. 125.
Vinogradov, A.I., Zaryankin, N.M., Prokop’ev, E.P., et al., Optimization of Parameters of the Deep Plasma Chemical Silicon Etching Process for MEMS Elements, Izv. vuzov. Elektronika, 2010, vol. 82, no. 2, pp. 3–9.
Author information
Authors and Affiliations
Corresponding author
Additional information
Original Russian Text © A.I. Vinogradov, N.M. Zaryankin, S.P. Timoshenkov, 2012, published in Izvestiya Vysshikh Uchebnykh Zavedenii. Elektronika, 2012, No. 1, pp. 54–58.
Rights and permissions
About this article
Cite this article
Vinogradov, A.I., Zaryankin, N.M. & Timoshenkov, S.P. Probe studies of plasma characteristics in the ICP reactor. Russ Microelectron 42, 433–437 (2013). https://doi.org/10.1134/S1063739712070116
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1063739712070116