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The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

  • Thermal Methods
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Russian Journal of Nondestructive Testing Aims and scope Submit manuscript

Abstract

Automated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to considerably improve the reliability of soldered joints.

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Authors and Affiliations

  1. El’tsin Ural Federal University, Yekaterinburg, Russia

    V. N. Shtennikov

  2. Physico-Technical Institute, El’tsin Ural Federal University, Yekaterinburg, Russia

    B. T. Budai

Authors
  1. V. N. Shtennikov
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  2. B. T. Budai
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Correspondence to V. N. Shtennikov.

Additional information

Original Russian Text © V.N. Shtennikov, B.T. Budai, 2013, published in Defektoskopiya, 2013, Vol. 49, No. 3, pp. 65–71.

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Shtennikov, V.N., Budai, B.T. The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices. Russ J Nondestruct Test 49, 178–183 (2013). https://doi.org/10.1134/S1061830913030078

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  • DOI: https://doi.org/10.1134/S1061830913030078

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