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Computer simulation of the two-stage ion polishing of a silicon surface

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Abstract

Comparative results of the computer simulation of surface sputtering by a focused ion beam with Gaussian density distribution and a uniform ion flux are presented. The experimental angular dependences of the yield of silicon sputtering by nitrogen and argon ions are used. The possibility of the optimization of ion polishing via methods of computer simulation is demonstrated.

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Correspondence to V. I. Bachurin.

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Original Russian Text © S.E. Birkgan, V.I. Bachurin, 2014, published in Poverkhnost’. Rentgenovskie, Sinkhrotronnye i Neitronnye Issledovaniya, 2014, No. 6, pp. 18–24.

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Birkgan, S.E., Bachurin, V.I. Computer simulation of the two-stage ion polishing of a silicon surface. J. Surf. Investig. 8, 524–529 (2014). https://doi.org/10.1134/S1027451014030252

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  • DOI: https://doi.org/10.1134/S1027451014030252

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