Abstract
We consider a technique for manufacturing LIGA x-ray masks based on direct formation of a deep pattern topology of the mask by an x-ray microbeam. This technique does not require an intermediate mask, which strongly simplifies manufacturing and reduces the laboriousness and cost of the LIGA masks created. The basic processing steps (substrate pretreatment, resist coating, exposure, resist development, and galvanic process), advantages, and disadvantages of these x-ray masks are described. Examples of the created prototypes of copper LIGA masks on glassy carbon substrates and substrate-free self-supporting masks are presented.
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Original Russian Text © E.V. Petrova, B.G. Gol’denberg, V.I. Kondrat’ev, L.A. Mezentseva, V.F. Pindyurin, A.N. Gentselev, V.S. Eliseev, V.V. Lyakh, 2007, published in Poverkhnost’. Rentgenovskie, Sinkhrotronnye i Neitronnye Issledovaniya, No. 6, pp. 14–19.
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Petrova, E.V., Gol’denberg, B.G., Kondrat’ev, V.I. et al. Fabrication of x-ray masks on a thick substrate for deep x-ray lithography. J. Surf. Investig. 1, 307–311 (2007). https://doi.org/10.1134/S1027451007030147
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DOI: https://doi.org/10.1134/S1027451007030147