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Microstructure-dependent oxidation-assisted dealloying of Cu0.7Al0.3 thin films

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Abstract

In this paper, the oxidation-assisted dealloying (OAD) of Cu0.7Al0.3 films with different microstructures which were obtained by high vacuum annealing at different temperatures were studied using powder X-ray diffraction, field-emission scanning electron microscopy and energy dispersive X-ray analysis. It was observed that different microstructures such as eutectic mixture or solid solution, the grain size of Cu or Al component in eutectic-mixture Cu0.7Al0.3 films affected the corrosion morphology greatly. It thus provided a practical route to fabricate flexible CuO porous nanostructure-films (PNFs) with controllable pore size, porosity, block size and shape. Further, the underlying OAD mechanisms for the structure-resultant different corrosion morphologies of Cu0.7Al0.3 films were also explored. In these senses, the study is suggestive and crucial to both the mechanism understanding of OAD process and the technical controlling of PNF fabrication.

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Authors and Affiliations

  1. Experiment Center of Electronic Science and Technology & Department of Electronic Science and Engineering, School of Mathematics and Physics, Changzhou University, Changzhou, 213164, PR China

    Jiangbin Su, Meiping Jiang, Honghong Wang & Yang Liu

  2. China-Australia Joint Laboratory for Functional Nanomaterials & Physics Department, Xiamen University, Xiamen, 361005, PR China

    Jiangbin Su

Authors
  1. Jiangbin Su
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  2. Meiping Jiang
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  3. Honghong Wang
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  4. Yang Liu
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Correspondence to Jiangbin Su.

Additional information

Published in Russian in Elektrokhimiya, 2015, Vol. 51, No. 9, pp. 937–943.

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Su, J., Jiang, M., Wang, H. et al. Microstructure-dependent oxidation-assisted dealloying of Cu0.7Al0.3 thin films. Russ J Electrochem 51, 827–832 (2015). https://doi.org/10.1134/S102319351509013X

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  • DOI: https://doi.org/10.1134/S102319351509013X

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