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Pitting resistance of anodic passive films formed on 316L stainless steel in the concentrated artificial seawater

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Abstract

The pitting resistance of anodic passive films formed on 316L stainless steel was studied in the concentrated artificial seawater with the concentration ratio (c R) ranged from 1.5 to 3 times under typical operation temperature condition of multi effect distillation (MED) by using the polarization curve and Mott-Schottky analysis. The pitting potential decreases linearly with the logarithm of c R. The anodic passive films are characterized by both n- and p-type semiconductive behavior, i.e., a bilayer microstructure. The density values of defects (i.e. N D and N A) are in the range of 1020 to 1021 cm−3, and increase with c R linearly. According to the point defect model (PDM), the increase of both Cl− concentration and defect density N D can facilitate the absorption of Cl− ions in the passive films, which is mainly responsible for the deterioration of pitting resistance in the concentrated artificial seawater.

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Authors and Affiliations

  1. Laboratory for Microstructures, Institute of Materials, Shanghai University, 149 Yanchang Road, Shanghai, 200072, China

    S. S. Xin & M. C. Li

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  1. S. S. Xin
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  2. M. C. Li
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Correspondence to M. C. Li.

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Published in Russian in Elektrokhimiya, 2014, Vol. 50, No. 3, pp. 314–321.

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Xin, S.S., Li, M.C. Pitting resistance of anodic passive films formed on 316L stainless steel in the concentrated artificial seawater. Russ J Electrochem 50, 281–288 (2014). https://doi.org/10.1134/S1023193513090097

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  • DOI: https://doi.org/10.1134/S1023193513090097

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