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Distribution of copper deposited under forced-convection conditions at a contour cathode

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Abstract

The effect of hydrodynamic conditions and solution composition on the distribution of copper electrodeposited on a contour cathode (profile parameters: a cylindrical cavity 1.5–3 mm in diameter and 0.55–2.56 mm in depth) is studied. In the case of high stability of the intermediate reduction product, Cu(I), a purposeful decrease in the current efficiency for metal at Reynolds numbers 50 to 250 has a pronounced leveling effect. When reduction Fe(III) + e → Fe(II) occurs in parallel to the main cathodic process, the coating’s uniformity significantly improves.

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Authors and Affiliations

  1. Agladze Institute of Inorganic Chemistry and Electrochemistry, National Academy of Sciences of Georgia, ul. Jikiya 7, Tbilisi, 380086, Georgia

    T. I. Lezhava, N. Sh. Ananiashvili, M. P. Kikabidze & J. A. Metreveli

Authors
  1. T. I. Lezhava
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  2. N. Sh. Ananiashvili
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  3. M. P. Kikabidze
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  4. J. A. Metreveli
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Correspondence to T. I. Lezhava.

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Original Russian Text © T.I. Lezhava, N.Sh. Ananiashvili, M.P. Kikabidze, J.A. Metreveli, 2007, published in Elektrokhimiya, 2007, Vol. 43, No. 3, pp. 319–324.

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Lezhava, T.I., Ananiashvili, N.S., Kikabidze, M.P. et al. Distribution of copper deposited under forced-convection conditions at a contour cathode. Russ J Electrochem 43, 301–306 (2007). https://doi.org/10.1134/S1023193507030093

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  • DOI: https://doi.org/10.1134/S1023193507030093

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