Abstract—
Various materials were tested for use in the elements of the cooling system for the readout electronics of the BM@N silicon tracking detector. The thermal design was performed using the ANSYS software package and the thermal conductivities of various adhesives and carbon-fiber composites were experimentally measured. The results were used to select materials for cooling fins. Thermal tests of the prototypes of front-end-board boxes have been carried out, during which various thermal interfaces were also tested.
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REFERENCES
Senger, P. and Dementev, D., Particles, 2019, vol. 2, p. 481. https://doi.org/10.3390/particles2040029
CBM Collaboration, Silicon Tracking System (STS), Technical Design Report, GSI, 2012. http://repository.gsi.de/record/54798/files/GSI-Report-2013-4.pdf.
The Silicon Tracking System as Part of the Hybrid Tracker of the BM@N Experiment, Technical Design Report, Dubna, 2019. https://bmn-wiki.jinr.ru/bin/download/Doc/4. Documents/4.4 BM%40N TDR/Hybrid tracker/WebHome/TDR_BM_N_hybrid_tracker_final.pdf?rev=1.2.
Aksöz, S., Ocak, Y., Maraslı, N., Cadirli, E., Kaya, H., and Böyük, U., Exp. Therm. Fluid Sci., 2010, vol. 34, p. 1507. https://doi.org/10.1016/j.expthermflusci.2010.07.015
Tablitsy fizicheskikh velichin. Spravochnik (Tables of Physical Quantities. Handbook), Kikoin, I.K., Ed., Moscow: Atomizdat, 1976.
Ovchinnikov, I.I. and Ovchinnikov, I.G., Internet-Zh. Naukoved., 2012, no. 4, p. 98.
Grushko, O.E., Vse Mater. Entsikl. Sprav., 2007, no. 2, p. 13.
Zherebchevsky, V.I., Altsybeev, I.G., Feofilov, G.A., Igolkin, S.N., Krymov, E.B., Lazareva, T.V., Maltsev, N.A., Prokofiev, N.A., Nesterov, D.G., Francescon, A., Gargiulo, C., Laudi, E., and Marzoa, M.G., J. Instrum., 2018, vol. 13, no. 8, p. T08003. https://doi.org/10.1088/1748-0221/13/08/T08003
Maier, S., MSc Thesis, Karlsruhe Institute of Technology, 2016. https://publish.etp.kit.edu/record/21348.
Zinchenko, V.F., Mekh. Polim., 1969, no. 3, p. 284.
Popov, V.M., Novikov, A.P., Kvitko, K.S., Kalashnikov, N.S., and Vnukov, A.N., Voronezh. Nauchno-Tekh. Vestn., 2018, no. 1 (23), p. 41. http://vestnikvglta.ru/arhiv/2018/1-1-23-2018/41-46.pdf.
Mozgovoi, N.V., Popov, V.M., and Popov, D.V., Vestn. Voronezh. Gos. Tech. Univ., 2018, vol. 14, no. 3, p. 56.
Teertstra, P., Proc. ASME InterPack Conference IPACK 2007, Vancouver, July 8−12, 2007. https://www.semanticscholar.org/paper/ThermalConductivity-and-Contact-Resistance-forTeertstra/cf6e0b53b934ac9236b7 adb226e54fce0c52f40d.
Zong, C., A Mathematical Theory for Random Solid Packings, 2014–10–04. http://arxiv.org/abs/1410.1102.
Dias, R.P., Teixeira, J.A., Mota, M.G., and Yelshin, A.I., Ind. Eng. Chem. Res., 2004, vol. 43, p. 7912. https://doi.org/10.1021/ie040048b
Vinokurov, A., Poluprovodn. Svetotekh., 2010, no. 3, p. 16.
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The research was funded by RFBR according to the projects 18-02-40113 and 19-32-90001.
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Dementev, D.V., Lygdenova, T.Z. & Kharlamov, P.I. Investigation and Optimization of a Cooling System Prototype for a Module of the Silicon Tracking System for the BM@N Experiment. Instrum Exp Tech 64, 40–47 (2021). https://doi.org/10.1134/S0020441220060159
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DOI: https://doi.org/10.1134/S0020441220060159