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A pulse-type evaporator for ultrafast deposition of thin films in ultrahigh vacuum

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Abstract

The design of a simple pulse-type evaporator ensuring a high rate (up to ∼104 nm/s) of deposition of thin films (0.01–100 nm thick) onto a solid surface in ultrahigh vacuum is described. The evaporation pulse is created by discharge of a capacitor bank via a fast-response evaporator produced from a tungsten foil. Results illustrating the efficiency of this device are presented.

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References

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Authors and Affiliations

  1. Institute of Automation and Control Processes, Far East Branch, Russian Academy of Sciences, ul. Radio 5, Vladivostok, 690041, Russia

    A. S. Gouralnik, N. G. Galkin, M. V. Ivanchenko & E. A. Chusovitin

  2. Faculty of Physics and Technology, Far East State University, ul. Sukhanova 8, Vladivostok, 690000, Russia

    N. G. Galkin & V. A. Ivanov

Authors
  1. A. S. Gouralnik
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  2. N. G. Galkin
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  3. V. A. Ivanov
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  4. M. V. Ivanchenko
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  5. E. A. Chusovitin
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Additional information

Original Russian Text © A.S. Gouralnik, N.G. Galkin, V.A. Ivanov, M.V. Ivanchenko, E.A. Chusovitin, 2007, published in Pribory i Tekhnika Eksperimenta, 2007, No. 3, pp. 132–135.

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Gouralnik, A.S., Galkin, N.G., Ivanov, V.A. et al. A pulse-type evaporator for ultrafast deposition of thin films in ultrahigh vacuum. Instrum Exp Tech 50, 408–410 (2007). https://doi.org/10.1134/S0020441207030190

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  • DOI: https://doi.org/10.1134/S0020441207030190

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