Abstract
The possibility of fabricating heavily doped (N a −N d ≥ 1 × 1019 cm−3) p +-4H-SiC layers on CVD-grown lightly doped n-4H-SiC layers by sublimation epitaxy has been demonstrated. It is shown that a Au/Pd/Ti/Pd contact, which combines a low specific contact resistance (∼2 × 10−5 Ω cm2) with high thermal stability (up to 700°C), is the optimal contact to p-4H-SiC. The p-n structures obtained are used to fabricate packaged diodes with a breakdown voltage of up to 1400 V.
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Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 39, No. 6, 2005, pp. 762–766.
Original Russian Text Copyright © 2005 by Bogdanova, Volkova, Cherenkov, Lebedev, Kakanakov, Kolaklieva, Sarov, Cholakova, Kirillov, Romanov.
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Bogdanova, E.V., Volkova, A.A., Cherenkov, A.E. et al. A 4H-SiCp-i-n diode fabricated by a combination of sublimation epitaxy and CVD. Semiconductors 39, 730–733 (2005). https://doi.org/10.1134/1.1944867
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DOI: https://doi.org/10.1134/1.1944867