Abstract
The effect of stimulating synthesis reactions for the Si3N4 phase in nitrogen-enriched silicon layers under the influence of argon-ion implantation into the rear side of silicon wafers was investigated. Dependences of variations in the IR absorption and the resistivity of the synthesized layers on argon-implantation dose were obtained. The morphology of a wafer surface after argon implantation with various doses was investigated by atomic-force microscopy. The effect is attributed to the action of shock waves arising owing to microbursts of argon blisters.
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Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 35, No. 1, 2001, pp. 21–24.
Original Russian Text Copyright © 2001 by Demidov, Karzanov, Lobanov, Markov, Sdobnyakov.
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Demidov, E.S., Karzanov, V.V., Lobanov, D.A. et al. A long-range influence of the argon-ion irradiation on the silicon nitride layers formed by the ion implantation. Semiconductors 35, 20–23 (2001). https://doi.org/10.1134/1.1340284
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DOI: https://doi.org/10.1134/1.1340284