Abstract
It was established that the laws of atomic hydrogen penetration from an arc reflection discharge gap with a hollow cathode and self-heating element into GaAs samples coated with a thin SiO2 film differ significantly from the laws observed for the hydrogenation of thin vanadium films. The amount of hydrogen penetrating into the SiO2/GaAs system decreases with increasing atomic hydrogen concentration in the gas phase. This is apparently related to a decrease in the probability of hydrogen atoms penetrating into the substrate, which is suggested to drop significantly with decreasing atomic energy and/or increasing hydrogen content in a thin subsurface layer.
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Translated from Pis’ma v Zhurnal Tekhnichesko\(\overset{\lower0.5em\hbox{$\smash{\scriptscriptstyle\smile}$}}{l}\) Fiziki, Vol. 26, No. 20, 2000, pp. 75–81.
Original Russian Text Copyright © 2000 by Bozhkov, Kagade\(\overset{\lower0.5em\hbox{$\smash{\scriptscriptstyle\smile}$}}{l}\), Proskurovski\(\overset{\lower0.5em\hbox{$\smash{\scriptscriptstyle\smile}$}}{l}\), Romas’.
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Bozhkov, V.G., Kagadei, V.A., Proskurovskii, D.I. et al. A comparative study of the atomic hydrogen penetration into thin vanadium films and silicon oxide-gallium arsenide structures. Tech. Phys. Lett. 26, 926–928 (2000). https://doi.org/10.1134/1.1321241
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DOI: https://doi.org/10.1134/1.1321241