Abstract
The dependence of the boron distribution on the initial boron concentration in the range (1–9)×1019 cm−3 was investigated by secondary-ion mass-spectrometry (SIMS) after heat treatment of boron-ion implanted silicon at 900 °C. It was found that when the initial boron concentration exceeds the solubility limit at the annealing temperature used, two additional peaks arise in the boron concentration profiles at the boundaries of the ion-implantation disordered region. It is suggested that their appearance in these regions at high doping levels is due to clustering of excess interstitial impurity atoms not built into the lattice sites following displacement of boron atoms from the lattice sites by intrinsic interstitials that leave the disordered region.
Similar content being viewed by others
References
A. M. Myasnikov, V. I. Obodnikov, V. G. Seryapin, E. G. Tishkovskii, B. I. Fomin, and E. I. Cherepov, JETP Lett. 60, 102 (1994).
A. M. Myasnikov, V. I. Obodnikov, V. G. Seryapin, E. G. Tishkovskii, B. I. Fomin, and E. I. Cherepov, Fiz. Tekh. Poluprovodn. 31, 338 (1997) [Semiconductors 31, 279 (1997)].
W. K. Hofker, H. W. Werner, D. P. Oosthoek, and H. A. M. de Grefte, Appl. Phys. Lett. 2, 265 (1973).
H. Ryssel, K. Muller, K. Haberger, R. Henkelmann, and F. Jahnel, Appl. Phys. Lett. 22, 35 (1980).
V. E. Borisenko and S. G. Yudin, Phys. Status Solidi A 101, 123 (1987).
M. G. Dowsett, E. A. Clark, and M. N. Lewis, in Proceedings of the Sixth International Conference on Secondary-Ion Mass Spectrometry SIMS-VI (1988), p. 725.
G. D. Watkins, Radiation Damage in Semiconductors (Dunod, Paris, 1964), p. 97.
G. Watkins, in Lattice Defects in Semiconductors (Conf. Ser. No. 23., Inst. Phys. London-Bristol, 1975), p. 1.
Author information
Authors and Affiliations
Additional information
Fiz. Tekh. Poluprovodn. 32, 417–420 (April 1998)
Rights and permissions
About this article
Cite this article
Obodnikov, V.I., Tishkovskii, E.G. Influence of the initial boron doping level on the boron atom distribution arising as a result of heat treatment in silicon implanted with boron ions. Semiconductors 32, 372–374 (1998). https://doi.org/10.1134/1.1187398
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1134/1.1187398