Abstract
Studies of the characteristics of ohmic contacts to epitaxial and ion-doped gallium-nitride layers, based on the Cr/Pt/Au metallization system, are reported. The possibility of forming low-resistance contacts without the application of high-temperature treatment is shown. It is demonstrated, for AlGaN/GaN-based heterostructures, that the characteristics of Ti/Al/Ni/Au ohmic contacts are improved upon using ion implantation through a silicon-dioxide mask.
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Funding
The work was prepared with financial support from the Ministry of Education and Science of Russia under the projective part of the State assignment, project no. 3.3572.2017/PCh.
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Translated by M. Tagirdzhanov
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Zhelannov, A.V., Ionov, A.S., Seleznev, B.I. et al. Ohmic Contacts to Gallium Nitride-Based Structures. Semiconductors 54, 317–321 (2020). https://doi.org/10.1134/S1063782620030197
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DOI: https://doi.org/10.1134/S1063782620030197