Integrated circuits usually have only one layer of electronic devices, which limits their performance and functionality. A 3D integrated circuit that incorporates multiple device layers enables a wealth of applications. See Letter p.74
Notes
References
Shulaker, M. M. et al. Nature 547, 74–78 (2017).
Davis, W. R. et al. IEEE Design Test Comput. 22, 498–510 (2005).
Or-Bach, Z. in CHIPS 2020 Vol. 2 (ed. Hoefflinger, B.) 51–91 (Springer, 2016).
Batude, P. et al. Proc. IEEE Electron Devices Meet. 7.3.1–7.3.4 (2011).
Liauw, Y. Y., Zhang, Z., Kim, W., Gamal, A. E. & Wong, S. S. Proc. IEEE Solid-State Circuits Conf. 406–408 (2012).
Golshani, N. et al. Proc. IEEE 3D Systems Integration Conf. http://dx.doi.org/10.1109/3DIC.2010.5751441 (2010).
Patil, N. et al. IEEE Trans. Nanotechnol. 8, 498–504 (2009).
Hearst, M. A., Dumais, S. T., Osuna, E., Platt, J. & Scholkopf, B. IEEE Intel. Syst. Appl. 13, 18–28 (1998).
Shulaker, M. M. et al. Nature 501, 526–530 (2013).
Reda, S., Smith, G. & Smith, L. IEEE Trans. Very Large Scale Integr. Syst. 17, 1357–1362 (2009).
Author information
Authors and Affiliations
Corresponding author
Related links
Rights and permissions
About this article
Cite this article
Reda, S. 3D integration advances computing. Nature 547, 38–39 (2017). https://doi.org/10.1038/547038a
Published:
Issue Date:
DOI: https://doi.org/10.1038/547038a
- Springer Nature Limited
This article is cited by
-
Graphene-based vertical thin film transistors
Science China Information Sciences (2020)