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Thermal behavior of Al-, AlFe- and AlCu-pillared interlayered clays

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Abstract

The purified bentonite parent clay, fraction ≤; 2 mm of montmorillonite type, has been pillared by various polyhydroxy cations, Al, AlFe and AlCu, using conventional pillaring methods. The thermal behavior of PILCs was investigated by combination of X-ray diffraction (XRD), thermal analysis (DTA, TG) and low temperature N2 adsorption/desorption (LTNA). Thermal stability of Al-, AlFe- and AlCu-PILC samples was estimated after isothermal pretreatment in static air on the temperatures 300, 500, 600 and 900°C. Crucial structural changes were not registered up to 600°C, but the fine changes in interlayer surrounding and porous/microporous structure being obvious at lower temperatures, depending on the nature of the second pillaring ion. AlFe-PILC showed higher thermal stability of the texture, the AlCu-PILC having lower values and lower thermal stability concerning both overall texture and micropore surface and volume. Poorer thermal stability of AlCu-PILC sample at higher temperatures was confirmed, the presence of Cu in the system contributing to complete destruction of aluminum silicate structure, by 'extracting' aluminum in stabile spinel form.

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Marinkovic-Neducin, R.P., Kiss, E.E., Cukic, T.Z. et al. Thermal behavior of Al-, AlFe- and AlCu-pillared interlayered clays. Journal of Thermal Analysis and Calorimetry 78, 307–321 (2004). https://doi.org/10.1023/B:JTAN.0000042177.82033.d0

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  • DOI: https://doi.org/10.1023/B:JTAN.0000042177.82033.d0

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