Abstract
The polycrystalline β-SiC fiber of diameter 14 μm (without a carbon core) is piezoresistive under tension, with gage factor 5. The resistivity increases linearly and reversibly with strain in the elastic regime. The fiber of diameter 140 μm (with a carbon core) is not piezoresistive, due to the carbon core controlling the electrical resistance.
Similar content being viewed by others
References
H. Du and H. Asanuma, Keikinzoku/J. of Japan Inst. of Light Metals, 48(2), 88 (1998).
M. Takada, H. Matsubara, S.G. Shin, T. Mitsuoka, and H. Yanagida, Nippon Seramikkusu Kyokai Gakujutsu Ronbunshi/J. Ceramic Soc. Japan, 108(1256), 397 (2000).
K. Maile, A. Udoh, and D. Walz, Materialpruefung, 40(6), 256 (1998).
X. Wang, X. Fu, and D.D.L. Chung, J. Mater. Res., 14(3), 790 (1999).
S. Wang, X. Shui, X. Fu, and D.D.L. Chung, J. Mater. Sci., 33(15), 3875 (1998).
S. Wen, S. Wang, and D.D.L. Chung, J. Mater. Sci., 35(14), 3669 (2000).
D.D.L. Chung, Mater. Sci. Eng. Rev., R22(2), 57 (1998).
S. Wang and D.D.L. Chung, Carbon, 35(5), 621 (1997).
D.D.L. Chung, Smart Mater. Struct., 9(4), 389 (2000).
N. Muto, M. Miyayama, and H. Yanagida, Nippon Seramikkusu Kyokai Gakujutsu Ronbunshi/J. Ceramic Soc. Japan, 97(3), 403 (1989).
N. Muto, M. Miyayama, H. Yanagida, T. Kajiwara, N. Mori, Y. Imai, H. Harada, and H. Ichikawa, Electronics & Communications in Japan, Part II: Electronics (English Translation of Denshi Tsushin Gakkai Ronbunshi), 74(9), 104 (1991).
W.S. Czarnocki and J.P. Schuster, Sensors (Peterborough, NH), 16(5), 8 (1999).
P.L. Walter, Sound & Vibration, 31(3), 16 (1997).
W. Baney, D. Chilcott, X. Huang, S. Long, J. Siekkinen, D. Sparks, and S. Staller, in Proceedings of the 1997 International Truck & Bus Meeting & Exposition, Electronics and Electrical Systems for Trucks and Buses, Cleveland, 1997 (SAE, Warrendale, 1997), p. 61.
A. Merlos, J. Santander, M.D. Alvarez, and F. Campabadal, J. Micromechanics & Microengineering, 10(2), 204 (2000).
O. Vallin and Y. Backlund, J. Micromechanics & Microengineering, 10(2), 196 (2000).
L. Wang and D.J. Beebe, Am. Soc. Mech. Eng., Dynamic Systems & Control Div., 67, 759 (1999).
L. Cao, T.S. Kim, S.C. Mantell, and D.L. Polla, Sensors & Actuators A–Physical, 80(3), 273 (2000).
L. Michelutti, N. Mathieu, A. Chovet, and A. Galerie, Microelectonics & Reliability, 40(1), 179 (2000).
F. Fruett and G.C.M. Meijer, Electronics Letters, 35(18), 1587 (1999).
A. Drushinin, E. Lavitska, I. Maryamova, I. Pankevich, and Y. Pankov, Electron Tech. (Warsaw), 32(1), 146 (1999).
B. Konrad and M. Ashauer, Sensors (Peterborough, NH), 16(7), 10 (1999).
S. Sahli and D.M. Aslam, Sensors & Actuators A–Physical, 71(3), 193 (1998).
W.L. Wang, K.J. Liao, B. Feng, G. Sanchez, M.C. Polo, and J. Esteve, Diamond & Related Mater., 7(2-5), 528 (1998).
P. Gluche, M. Adamschik, A. Vescan, W. Ebert, F. Szucs, H.J. Fecht, A. Floter, R. Zachai, and E. Kohn, Diamond & Related Mater., 7(6), 779 (1998).
S. Sahli and D.M. Aslam, Sensors & Actuators A–Physical, 69(1), 27 (1998).
W.L. Wang, X. Jiang, K. Taube, and C.-P. Klages, J. Applied Physics, 82(2), 729 (1997).
Y. Boiko, P. Gonon, S. Prawer, and D.N. Jamieson, Mater. Sci. & Eng. B–Solid State Mater. for Adv. Tech., 46(1-3), 112 (1997).
M. Deguchi, M. Kitabatake, and T. Hirao, Thin Solid Films, 281/282(1/2), 267 (1996).
J.L. Davidson, D.R. Wur, W.P. Kang, and D.L. Kinser, Sensors (Peterborough, NH), 12(11), 32 (1995).
I. Taher, M. Aslam, M.A. Tamor, T.J. Potter, and R.C. Elder, Sensors & Actuators A–Physical, 45(1), 35 (1994).
P.R. Chalker, IEE Colloquium (Digest), 37(59), 2 (1997).
J.B. Sickles and J.W. Dally, in Proceedings of the 37th International Instrumentation Symposium in the Aerospace Industry, San Diego, 1991 (ISA Aerospace Instrumentation, 1991), Vol. 37, p. 1049.
S.J. Deteresa, Carbon, 29(3), 397 (1991).
A.S. Crasto and R.Y. Kim, in Proceedings of the 8th Technical Conference of the American Society for Composites, Cleveland, 1993 (Technomic Publ. Co. Inc., Lancaster, 1993), p. 162.
K. Arshak and R. Perrem, Sensors & Actuators A–Physical, 36(1), 73 (1993).
D.G. Collins and K.I. Arshak, Microelectronics J., 27(1), 59 (1996).
K.I. Arshak, D.G. Collins, D. Mcdonagh, and F. Ansari, Int. J. Electronics, 81(4), 419 (1996).
S.E. Dyer, O.J. Gregory, P.S. Amons, and A.B. Slot, Thin Solid Films, 288(1/2), 279 (1996).
M. Tamborin, S. Piccinini, M. Prudenziati, and B. Morten, Sensors & Actuators A–Physical, 58(2), 159 (1997).
M. Kuwabara and K. Hamamoto, J. Intelligent Mater. Sys. & Struct., 10(6), 434 (2000).
M. Kuwabara, H. Matsuda, and K. Hamamoto, J. Electroceramics, 4(Supp 1), 99 (2000).
J.S. Capurso and W.A. Schulze, J. Am. Ceramic Soc., 81(2), 347 (1998).
M. Kuwabara, H. Matsuda, and K. Hamamoto, J. Am. Ceramic Soc., 80(7), 1881 (1997).
W.A. Schulze and J.S. Capurso, Int. J. Microcircuits & Electronic Packaging, 19(2), 162 (1996).
C. Hu, Y. Gao, and Z. Sheng, J. Mater. Sci., 35(2), 381 (2000).
J. Millett, N. Bourne, and Z. Rosenberg, J. Phusics D–Applied Physics, 31(9), 1126 (1998).
R. Buchhold, A. Nakladal, G. Gerlach, and P. Neumann, Sensors & Actuators B–Chemical, 53(1/2), 1 (1998).
R. Buchhold, A. Nakladal, U. Buettner, and G. Gerlach, Measurement Sci. & Tech., 9(3), 354 (1998).
Y.Q. Wang, R.E. Giedd, M.G. Moss, and J. Kaufmann, Nuclear Instruments & Methods in Physics Res. Sec. B–Beam Interactions with Mater. & Atoms, 127/128, 710 (1997).
P.R. Somani, R. Marimuthu, U.P. Mulik, S.R. Sainkar, and D.P. Amalnerkar, Synthetic Metals, 106(1), 45 (1999).
Q. Zheng, Y. Song, and X.-S. Yi, J. Mater. Sci. Letters, 18(1), 35 (1999).
M. Taya, W.J. Kim, and K. Ono, Mechanics of Mater., 28(1-4), 53 (1998).
S. Radhakrishnan, S. Chakne, and P.N. Shelke, Mater. Letters, 18(5/6), 358 (1994).
B.A. Frazier, C.S. Olson, S.P. Turner, and M.G. Allen, Int. J. of Microcircuits & Electronic Packaging 17(1), 37 (1994).
E. Litwin-Staszewska, W. Trazeciakowski, L. Dmowski, R. Piotrzkowski, L. Gonzalez, and Z. Zytkiewicz, Sensors & Actuators A–Physical 78(2), 130 (1999).
A. Dehe, K. Fricke, K. Mutamba, and H.L. Hartnagel, J. Micromechanics & Microengineering, 5(2), 139 (1995).
J.S. Shor, D. Goldstein, and A.D. Kurtz, IEEE Transactions on Electron Devices, 40(6), 1093 (1993).
R. Ziermann, J. Von Berg, E. Obermeier, F. Wischmeyer, E. Niemann, H. Moeller, M. Eickhoff, and G. Kroetz, Mater. Sci. & Eng. B–Solid State Mater. for Adv. Tech., 61, 576 (1999).
J.S. Shor, L. Bemis, and A.D. Kurtz, IEEE Transactions on Electron Devices, 41(5), 661 (1994).
T. Homma, K. Kamimura, H.Y. Cai, and Y. Onuma, Sensors & Actuators A–Physical, 40(2), 93 (1994).
A. Sandhu and S. Jinno, Electronics Letters, 36(6), 497 (2000).
J.S. Shor, D. Goldstein, and A.D. Kurtz, in Proceedings of the 1991 International Conference on Solid-State Sensors and Actuators, San Francisco, 1991 (IEEE, IEEE Service Center, Piscataway, 1991), p. 912.
R. Ziermann, J. Von Berg, W. Reichert, E. Obermeier, M. Eickhoff, and G. Kroetz, in Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators, Chicago, 1997 (IEEE, Piscataway, 1997), Vol. 2, p. 1411.
J. Strass, M. Eickhoff, and G. Kroetz, in Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators, Chicago, 1997 (IEEE, Piscataway, 1997), vol. 2, p. 1439.
M.J. Yasin, I. El-Rihail, M.S. Ahmad, and A.M. Zihlif, Mater. Sci. & Eng., 86(12), 205 (1987).
X. Wang and D.D.L. Chung, Carbon, 35(5), 706 (1997).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Wang, S., Chung, D. Piezoresistivity in Silicon Carbide Fibers. Journal of Electroceramics 10, 147–152 (2003). https://doi.org/10.1023/B:JECR.0000011213.58831.45
Issue Date:
DOI: https://doi.org/10.1023/B:JECR.0000011213.58831.45