Abstract
The electrical resistance of the contact between tungsten and silicon–germanium alloys of different compositions was measured as a function of temperature. The results indicate that the room-temperature contact resistance increases with increasing Ge content, annealing temperature, and annealing time. With increasing measuring temperature, the contact resistance drops to a level of the experimental error. Annealing at 1070 K tends to break down both W/p-Si–Ge and W/n-Si–Ge contacts.
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Barbakadze, K.G., Vekua, T.S., Krivoruchko, S.P. et al. Electrical Resistance of W/Si–Ge (0–75 wt % Ge) Contacts. Inorganic Materials 39, 1227–1232 (2003). https://doi.org/10.1023/B:INMA.0000008905.54637.12
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DOI: https://doi.org/10.1023/B:INMA.0000008905.54637.12