Abstract
The paper presents a microhardness study of thick crack-free hydride vapor phase epitaxial GaN layers (not intentionally doped), and of thin metal-organic vapor phase epitaxial (MOVPE) GaN layers (undoped and Si-doped), grown on sapphire. A Vickers indentation method was used to determine the microhardness under applied loads up to 2 N. An increase in the microhardness was observed with decreasing carrier concentration and increasing mobility. A dip at an indentation depth of about 0.75 μm is observed in the microhardness profile in the MOVPE films, and is correlated with peculiarities in the spatially resolved cathodoluminescence spectra. The relationship between the mechanical and electrophysical parameters is discussed.
Similar content being viewed by others
References
R. Nowak, M. Pessa, M. Suganuma, M. Leszczynski, I. Grzegory, S. Porowski and F. Yoshida, Appl. Phys. Lett. 75 (1999) 2070.
S. O. Kucheyev, J. S. Williams, J. Zou, J. E. Bradby, C. Jagadish and G. Li, Phys. Rev B 63 (2001) 113202.
T. Paskova, S. Tungasmita, E. Valcheva, E. B. Sveberg, B. Arnaudov, S. Evtimova, P. A. Person, A. Henry, R. Beccard, M. Heuken and B. Monemar, MRS Internet J. Nitride Semicond. Res. 5S1 (2000) W.3.14.
B. Arnaudov, T. Paskova, S. Evtimova, M. Heuken and B. Monemar, in Proceedings of the International Workshop on Nitride Semiconductors, Aachen, July 2002 (in press).
S. Nakamura, T. Mukai and M. Senoh, Jpn. J. Appl. Phys. 31 (1992) 195.
S. Ruvimov, Z. Liliental-Weber, T. Suski, J. W. Ager, J. Washburn, J. Krueger, C. Kisielowski, E. R. Weber, H. Amano and I. Akasaki, Appl. Phys. Lett. 69 (1996) 990.
W. J. Moore, J. A. Freitas Jr, S. K. Lee, S. S. Park and J. Y. Han, Phys. Rev B 65 (2002) 81201.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Evtimova, S., Arnaudov, B., Paskova, T. et al. Effect of carrier concentration on the microhardness of GaN layers. Journal of Materials Science: Materials in Electronics 14, 771–772 (2003). https://doi.org/10.1023/A:1026188701129
Issue Date:
DOI: https://doi.org/10.1023/A:1026188701129