The Oxidation of Two Ternary Ni–Cu–5 at.%Al Alloys in 1 atm of Pure O₂ at 800–900°C

Abstract

The oxidation of a Ni-rich and a Cu-rich single-phase ternary alloy containing about 5 at.% aluminum has been studied at 800 and 900°C under 1 atm O₂. The behavior of the Ni-rich alloy is similar to that of a binary Ni–Al alloy with a similar Al content at both temperatures, with formation of an external NiO layer coupled to the internal oxidation of aluminum. The Cu-rich ternary alloy shows a larger tendency to form protective alumina scales, even though its behavior is borderline between protective and non-protective. In fact, at 800°C, after an initial stage of fast reaction during which all the alloy components are oxidized, this alloy is able to develop a continuous layer of alumina at the base of the scale which prevents the internal oxidation of aluminum. On the contrary, at 900°C the innermost alumina layer undergoes repeated rupturing followed by healing, so that internal oxidation of Al is only partly eliminated. As a result, the corrosion kinetics of the Cu-rich ternary alloy at 900°C are much faster than at 800°C and very similar to those of pure copper and of Al-dilute binary Cu–Al alloys. Possible reasons for the larger tendency of the Cu-rich alloy to form external alumina scales than the Ni-rich alloy are examined.