Abstract
This paper considers the process of change in the structure of aluminum films on silicon in metallizing integrated microcircuits under the conditions of both prolonged and fast thermal treatment. We propose an analytical model of the formation and recrystallization of condensed aluminum films. It is based on the application of the Monte Carlo method and describes the change in the size and angles at triple points depending on the temperature and time of thermal treatment.
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REFERENCES
V. M. Anishchik, V. A. Gorushko, V. A. Pilipenko, V. N. Ponomar’, V. V. Ponaryadov, and I. V. Pilipenko, Physical Principles of Fast Thermal Treatment. Development of Multilevel Metallization[in Russian], Minsk (2000).
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Pilippenko, V.A., Malofeev, V.M., Ponomar', V.N. et al. Modeling of the Morphology of Aluminum Films before and after Different Kinds of Thermal Treatment. Journal of Engineering Physics and Thermophysics 76, 858–863 (2003). https://doi.org/10.1023/A:1025662524229
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DOI: https://doi.org/10.1023/A:1025662524229