Abstract
We have developed a radically new technological process of making very large‐scale integrated circuits, which has no analogs and is based on the use of fast heat treatments for forming gettering layers, silicon oxidation, annealing of ion‐doped layers, fusion of phosphoro‐ and borophosphorosilicate glasses, forming silicides, and increasing the thermostability of aluminum metallization.
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REFERENCES
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Pilippenko, V.A., Ponomar', V.N. & Gorushko, V.A. Control of the Properties of Thin‐Film Systems with the Use of Pulsed Photon Treatment. Journal of Engineering Physics and Thermophysics 76, 854–857 (2003). https://doi.org/10.1023/A:1025610507391
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DOI: https://doi.org/10.1023/A:1025610507391