Properties of high reinforcement-content aluminum matrix composite for electronic packages

Abstract

Aluminum matrix composites reinforced by a high volume fraction of ceramic particles provide a novel solution to electronic packaging technology, because of their high thermal conductivity, compatible and tailorable coefficient of thermal expansion (CTE) with chips or substrates, low weight, enhanced specific stiffness, and low cost. In this paper, SiC-particle-reinforced aluminum matrix composites are fabricated by the cost-effective squeeze-casting technology, and their microstructure characteristics, thermo-physical, and mechanical properties are investigated. The reinforcement volume fraction is as high as 70% and composites with linear CTE of 6.9–9.7×10⁻⁶ °C⁻¹ and thermal conductivity of 120–170 W m⁻¹ °C⁻¹ are produced. The composites can be electric-discharge machined, ground, and electric-spark drilled. An electroless nickel layer is plated on the composite by the conventional procedures. Finally, their potential applications in electronic packaging and thermal management are illustrated via prototype examples.