Abstract
The features of the arrangement of a procedure of measuring thermal kinetic characteristics (specific heats of films and substrates, the substrate thermal conductivity, and the thermal resistance of the film–substrate and substrate–thermostat interfaces) of film structures using a computer are described. An amplifier circuit developed taking into account the technical and procedure requirements of the method is presented. The circuit includes a wide-band dc amplifier with a differential input and a linear amplitude–frequency characteristic in the range of 0 to 2 × 106 Hz combined with a sample-and-hold circuit for controlling the dc component of a pulse signal.
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Nikolaenko, Y.M., Pashkevich, Y.G. & Lemmens, P. Measurements of Thermal Kinetic Characteristics of Film Structures. Instruments and Experimental Techniques 45, 853–857 (2002). https://doi.org/10.1023/A:1021464029534
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DOI: https://doi.org/10.1023/A:1021464029534