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Calculation of the Temperature Field of a Printed-Circuit Board with Account for Convective and Radiative Heat Exchange on the Board Surface

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Abstract

The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ±4°C.

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REFERENCES

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  2. A. A. Borisov, V. M. Gorbacheva, G. D. Kartashov, M. N. Martynova, and S. F. Prytkov, Zarubezhn. Radioélektron., No. 5, 34–53 (2000).

  3. G. N. Dul'nev, V. G. Parfenov, and A. V. Sigalov, Methods of Calculation of the Thermal Mode of Devices [in Russian], Moscow (1990).

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Authors and Affiliations

  1. Tomsk State University of Control Systems and Radioelectronics, Tomsk, Russia

    V. P. Alekseev, G. V. Kuznetsov & S. V. Shloma

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  1. V. P. Alekseev
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  2. G. V. Kuznetsov
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  3. S. V. Shloma
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Alekseev, V.P., Kuznetsov, G.V. & Shloma, S.V. Calculation of the Temperature Field of a Printed-Circuit Board with Account for Convective and Radiative Heat Exchange on the Board Surface. Journal of Engineering Physics and Thermophysics 75, 1223–1226 (2002). https://doi.org/10.1023/A:1021196431370

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  • DOI: https://doi.org/10.1023/A:1021196431370

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