Abstract
Copper(II) complexes formed in the interphase area between Thiokol-epoxy adhesive and brass support were studied using the method of the envelope of modulation of the electron spin echo.
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Nefed'ev, E.S., Rakhmatullin, R.M., Orlinskii, S.B. et al. The Nature of Copper(II) Complexes in the Transition Layer of Thiokol Sealant-Brass Adhesive Joint. Russian Journal of Applied Chemistry 75, 1339–1344 (2002). https://doi.org/10.1023/A:1020933616155
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DOI: https://doi.org/10.1023/A:1020933616155