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Heat-resistant joints of Si3N4 ceramics with intermetallic compounds formed in situ

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Abstract

The possibility of the improvement on the heat resistance of Si3N4 ceramic joints with intermetallic compounds formed in situ was investigated. The Si3N4 ceramics were joined with Ti/Ni/Ti multi-interlayers between 1000 and 1150°C. The effects of various parameters, which include the thickness of Ti and Ni foils, the pressure imposed during bonding, the bonding temperature and the holding time, on the microstructures and the strength (both at room temperature and at high temperature) of the joints were studied. The results indicated that the sound joints with higher strength both at room temperature and at elevated temperature could be acquired with intermetallic compounds formed in situ under appropriate bonding parameters. The shear strength at 800°C could sustain about 88 MPa.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Tsinghua University, Beijing, 100084, People's Republic of China

    Aiping Wu, Guisheng Zou, Jialie Ren, Weijia Ren & Sheng Li

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  1. Aiping Wu
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  2. Guisheng Zou
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  3. Jialie Ren
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  4. Weijia Ren
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  5. Sheng Li
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Correspondence to Aiping Wu.

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Wu, A., Zou, G., Ren, J. et al. Heat-resistant joints of Si3N4 ceramics with intermetallic compounds formed in situ. Journal of Materials Science 36, 2673–2678 (2001). https://doi.org/10.1023/A:1017956611803

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  • DOI: https://doi.org/10.1023/A:1017956611803

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