Abstract
It is suggested that chemical and heat treatment of surfaces under moist conditions (including also chemical assembly of a surface by molecular layering) and gas-cutting be used to fabricate silicon on insulator structures to obtain silicon wafer surfaces with prescribed chemical composition, activation, and surface modification.
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Suvorov, A.L., Grafutin, V.I., Zaluzhnyi, A.G. et al. Silicon Wafer Bonding by Chemical Assembly of a Surface by Molecular Layering and Gas Cutting. Atomic Energy 91, 793–800 (2001). https://doi.org/10.1023/A:1013888021077
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DOI: https://doi.org/10.1023/A:1013888021077