Skip to main content
SpringerLink
Log in

Ultrasonic measurements of microelectronic molding compounds

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

We report ultrasonic measurements on commercial molding compounds used in the microelectronic industries. The elastic moduli of epoxy resins loaded with silica particles have been measured using ultrasonic wave propagation. Precise measurements of velocity propagation and attenuation were carried out in a large temperature (4–420 K) and frequency (1–100 MHz) ranges. The influence of frequency on the attenuation is discussed.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. G. M. Crean, C. M. Flannery and S. C. O. Mathuna, in “Advances in Acoustic Mcroscopy”, edited by A. Briggs (1995) p. 1.

  2. S. Mimran, Thesis University of Grenoble, December (1999).

  3. M. T. Goosey, in “Plastic for Electronics”, edited by M. T. Goosey (Elsevier Applied Science Publishers, London 1985).

    Google Scholar 

  4. S. Canumalla and L. W. Kessler, in International Reliability Symposium (Denver, 1997).

  5. P. Gonon, A. Sylvestre, J. Teysseyre and C. Prior J. Mater. Sci.: Mater. Electronics 12 (2001) 81.

    Google Scholar 

  6. S. Ahmed, F. R. Jones, J. Mater. Sci. 25 (1990) 4933.

    Google Scholar 

  7. Z. Hashin and S. Shtrikman, J. Mech. Phys. Solid. 11 (1963) 127.

    Google Scholar 

  8. A. Jdevaney, J. Math. Phys. 21, (1980) 2603; A. J. Devaney and H. Levine Appl. Phys. Lett 37 (1980) 377.

    Google Scholar 

  9. E. P. Papadakis J. Acous. Soc. Am. 37 (1965) 703.

    Google Scholar 

  10. R. A. Pethrick Prog. Polymer. Sci. 9 (1983) 197.

    Google Scholar 

  11. I. Perepechko, in “Low Temperature Properties of Polymers Mir”, (Moscow Pergamon Press, 1977).

  12. R. Truell, C. Elbaum and C. Chick, in “Ultrasonic methods in solid state physics” (Academic Press, NY, 1969).

    Google Scholar 

  13. C. A. Condat, J. Acoust. Soc. Am 83 (1988) 441.

    Google Scholar 

  14. B. E. White and R. O. Pohl Z. Phys. B 100 (1996) 401.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. STMicroelectronics, 12 rue Jules Horowitz BP 217, 38019, Grenoble, France

    A. Clément

  2. Center de Recherches sur les Très Basses Températures CNRS BP 166, Grenoble cédex 9, France

    M. Saint-Paul

Authors
  1. A. Clément
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. M. Saint-Paul
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Clément, A., Saint-Paul, M. Ultrasonic measurements of microelectronic molding compounds. Journal of Materials Science: Materials in Electronics 13, 21–25 (2002). https://doi.org/10.1023/A:1013190812644

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1023/A:1013190812644

Keywords

Search

Navigation