Abstract
The joining of Si3N4/Si3N4 was carried out using CuNiTiB paste brazing filler metals. The maximum room-temperature three-point bend strength of the joints is 338.8 MPa. The cross-section microstructures of the joints and the element area distribution were examined by scanning electron microscope (SEM) equipped with wave dispersive X-ray spectroscopy (WDS). The phases appeared on the fracture surfaces of the joints were determined by means of X-ray diffraction analysis (XRDA) method. A model is established of the interfacial reactions between Si3N4 and the CuNiTiB brazing filler metals. With this model, the relationship between the joint strength and the interfacial reactions is discussed.
Similar content being viewed by others
References
F. H. Bao, J. L. Ren and Y. H. Zhou, Trans. of the China Welding Institution 11 (1990) 200 (in Chinese).
A. P. Xian and Z. Y. Si, J. Mater. Sci. 25 (1990) 4483.
D. H. Kim, S. H. Hwang and S. S. Chun, ibid. 26 (1991) 3223.
M. Naka, T. Tanaka and I. Okamoto, Trans. of JWRI 16 (1987) 83.
W. X. Pan, T. Okamoto and X. S. Ning, J. Mater. Sci. 29 (1994) 1436.
R. E. Loehman, A. P. Tomsia, J. A. Pask and S. M. Johnson, J. Amer. Ceram. Soc. 73 (1990) 552.
Y. Nakao, K. Nishimoto and K. Saida, Trans. of the Japan Welding Society 20 (1989) 66.
C. Wan, H. Xiong and Z. Zhou, J. Mater. Sci. Technol. 12 (1996) 219.
H. Xiong, C. Wan and Z. Zhou, ChinaWelding 5 (2) (1996) 102.
A. R. Miedema, F. R. DeBoer, R. Boom and J. W. F. Dorleijn, Calphad 1 (1977) 353.
K. Sugnuma, “Joining of ceramics,” edited by M. G. Nicholas (Chapman and Hall, London, 1990) p.122.
T. Nishino, S. Urai, I. Okamoto and M. Naka, Welding International 6 (1992) 600.
P. M. Scott, J. Mater. Sci. 10 (1975) 1833.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Wan, C., Xiong, H. & Zhou, Z. Joining of Si3N4/Si3N4 with CuNiTiB paste brazing filler metals and interfacial reactions of the joints. Journal of Materials Science 34, 3013–3019 (1999). https://doi.org/10.1023/A:1004672426832
Issue Date:
DOI: https://doi.org/10.1023/A:1004672426832