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Modelling of through-hole electrodeposition Part II: Experimental study

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Abstract

Current distribution measurements in through-hole electrodeposition were made on sectioned copper electrodes in a cylindrical flow channel. Two copper plating solutions with the same copper sulfate concentration but with different sulfuric acid concentrations were used. Experiments were conducted potentiostatically and under steady-state conditions. Results were compared with those from the theoretical model.

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References

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Author notes

  1. S.H. Chan

    Present address: Bristol–Myers Squibb Pharmaceutical Research Institute, New Brunswick, NJ, 08903, USA

  2. H.Y. Cheh

    Present address: Duracell, Berkshire Corporate Park, Bethel, CT, 06801, USA

Authors and Affiliations

  1. Department of Chemical Engineering and Applied Chemistry, Columbia University, New York, NY, 10027, USA

    S.H. Chan & H.Y. Cheh

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  1. S.H. Chan
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  2. H.Y. Cheh
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Chan, S., Cheh, H. Modelling of through-hole electrodeposition Part II: Experimental study. Journal of Applied Electrochemistry 31, 617–622 (2001). https://doi.org/10.1023/A:1017550129955

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  • DOI: https://doi.org/10.1023/A:1017550129955

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